The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
Light amber 1.8W Phase Changing materials High Thermal of K10 Thermally pad for Car Battery & Power Supply The TIC800K Series products is a high thermal conduction and dielectric performance insulator pad ... Read More
3mmT*200*400mm size 6.2W/mK thermal gap filler from China factory The TIF6120G thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation ... Read More
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC808A is low melting point thermal interface material. At 50, The TIC808A Series begins to soften and flow, filling the ... Read More
High Frequency Microprocessors Thermal Interface Pad Low Resistance -25 - 125 The TIC800P Series is low melting point thermal interface material. At 50, The TIC800P Series begins to soften and flow, filling the ... Read More
Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024-in / W The TIC803Y Series is low melting point thermal interface material. At 50, The TIC800Y Series begins to soften and flow, filling ... Read More
No Need Preheating Pink Thermal Phase Change Interface Material For Notebook The TIC808P Series is low melting point thermal interface material. At 50, The TIC808P Series begins to soften and flow, filling the ... Read More
Gray -25 - 125 Thermal Interface Material Phase Change for High Power LED Lights TIC805G series is low melting point thermal interface material. At 50, TIC800G series begins to soften and flow, filling the ... Read More
Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow TIC800G series is low melting point thermal interface material. At 50, TIC800G series begins to soften and flow, ... Read More
Pink Low Resistance Thermal phase chaging materials Interface Pad For Computer Serves 0.95 W/MK The TIC803P Series is low melting point thermal interface material. At 50, The TIC800P Series begins to soften and ... Read More
CPU Gray 2.5w Phase Changing materials High Thermal of T-PCM585 Thermally pad The TIC800A Series is low melting point thermal interface material. At 50, The TIC800A Series begins to soften and flow, filling the ... Read More
