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4 0 w m k heat sink pad

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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4 0 w m k heat sink pad

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Manufature Gray Thermal Conductive Pad For RDRAM Memory Modules
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Manufature Gray Thermal Conductive Pad For RDRAM Memory Modules With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in ... Read More

2025-01-03 09:05:02

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook
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3.2 W/mK High Tack Surface Reduces Contact Resistance Thermal pad for Notebook The TIF1140-32-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant ... Read More

2023-09-25 16:52:43

Specific Gravity 1.9 G/Cc Thermal Pad Silicone For Cpu
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Specific gravity 1.9 g/cc silicone pads Outstanding thermal performance for CPU The TIF1140-01US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant ... Read More

2023-10-20 09:39:00

Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible
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Specific Gravity 2.2 g/cc Silicone Pads Soft and Compressible for Low Stress Applications for CPU The TIF160-10UF use a special process, with silicone as the base material, adding thermal conductive powder and ... Read More

2023-11-10 15:15:26

Highly Efficient Thermal Conductivity 1.2W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials
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Highly Efficient Thermal Conductivity 1.2W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials The TIF100-12-66U thermally conductive interface materials are applied to fill the air gaps ... Read More

2025-10-09 08:35:29

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