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Product Details:
Payment & Shipping Terms:
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| Feature: | RoHS Compliant | Keyword: | Thermal Gap Pad |
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| Application: | Monitoring The Power Box | Name: | Specific Gravity 2.2 G/cc Silicone Pads Soft And Compressible For Low Stress Applications For CPU |
| Specific Gravity: | 2.2 G/cc | Color: | Gray |
| High Light: | rohs compliant thermal gap pad,compressible thermal gap pad,2.2 g/cc thermal interface pad |
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Specific Gravity 2.2 g/cc Silicone Pads Soft and Compressible for Low Stress Applications for CPU
The TIF160-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-10UF Datasheet-REV02.pdf
Features
> Good thermal conductive: 1.5 W/mK
>Thickness: 1.5mmT
>hardness:75 shore 00
>Colour: gray
>Good thermal conductive
>Moldability for complex parts
>Soft and compressible for low stress applications
Applications
>LED Power Supply
>LED Controller
>LED Ceilinglamp
>Monitoring the Power Box
>AD-DC Power Adapters
>Rainproof LED Power
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Typical Properties of TIF160-10UF Series
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Color
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gray |
Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
2.2 g/cc |
ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
1.5mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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75 Shore 00 |
ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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| Outgasing (TML) |
0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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3.9 MHz |
ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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1.5 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us.
4. We will reply you as soon as possible with Email or online.
Contact Person: Miss. Dana
Tel: 18153789196
