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Product Details:
Payment & Shipping Terms:
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| Thickness Tolerance: | ±0.0008" (±0.019mm) | Color: | Gray |
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| Thermal Conductivity: | 2.5 W/mK | Thermal Lmpedance @ 50 Psi(345 KPa)@ 50 Psi(345 KPa): | 0.30℃-cm²/W |
| Work Temperature: | -25℃～125℃ | Phase Transition Temperature: | 50℃~60℃ |
| High Light: | thermal insulating materials,heat sensitive materials,2.5 W/mK Phase Changing Materials |
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TIC808A Phase Changing Materials in High Frequency Microprocessors
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
TIC800A Series Datasheet-(E)-REV01.pdf
The TIC800A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC800A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
| Typical Properties of TIC800A Series | |||||
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Product Name
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TIC803A
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TIC805A
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TIC808A
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TIC810A
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Testing standards
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Color
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Ashy
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Ashy
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Ashy
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Ashy
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Visual
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Composite Thickness
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0.003"
(0.076mm) |
0.005"
(0.126mm) |
0.008"
(0.203mm) |
0.010"
(0.254mm) |
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Thickness Tolerance
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±0.0006"
(±0.016mm) |
±0.0008"
(±0.019mm) |
±0.0008"
(±0.019mm) |
±0.0012"
(±0.030mm) |
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Density
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2.5g/cc
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Helium Pycnometer
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Work Temperature
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-25℃～125℃
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phase transition temperature
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50℃~60℃
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Thermal conductivity
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2.5 W/mK
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ASTM D5470 (modified)
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Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa)
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0.018℃-in²/W
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0.020℃-in²/W
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0.047℃-in²/W
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0.072℃-in²/W
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ASTM D5470 (modified)
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0.11℃-cm²/W
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0.13℃-cm²/W
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0.30℃-cm²/W
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0.46℃-cm²/W
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Features:
> 0.020℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.
Contact Person: Miss. Dana
Tel: 18153789196
