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TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible

TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible
TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible

Large Image :  TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC808A
Payment & Shipping Terms:
Minimum Order Quantity: 1000PC
Price: USD 0.03PCS
Packaging Details: 1000PCS/bag
Delivery Time: 2-3Works
Supply Ability: 100000PCS/DAY
Detailed Product Description
Thickness Tolerance: ±0.0008" (±0.019mm) Color: Gray
Thermal Conductivity: 2.5 W/mK Thermal Lmpedance @ 50 Psi(345 KPa)@ 50 Psi(345 KPa): 0.30℃-cm²/W
Work Temperature: -25℃~125℃ Phase Transition Temperature: 50℃~60℃
High Light:

thermal insulating materials

,

heat sensitive materials

,

2.5 W/mK Phase Changing Materials

TIC808A Phase Changing Materials in High Frequency Microprocessors

 

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 


TIC800A Series Datasheet-(E)-REV01.pdf

 

The TIC800A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. 


      The TIC800A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 

 

 

 

Typical Properties of TIC800A Series
Product Name
TIC803A
TIC805A
TIC808A
TIC810A
Testing standards
Color
Ashy
Ashy
Ashy
Ashy
Visual
Composite Thickness
0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.5g/cc
  Helium   Pycnometer
Work Temperature
-25℃~125℃
 
phase transition  temperature
50℃~60℃
 
Thermal conductivity
2.5 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa)
0.018℃-in²/W
0.020℃-in²/W
0.047℃-in²/W
0.072℃-in²/W
ASTM D5470 (modified)
0.11℃-cm²/W
0.13℃-cm²/W
0.30℃-cm²/W
0.46℃-cm²/W
 
 
Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)            
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.

Features:


> 0.020℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required


Applications:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

 
TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible 0
 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)