Home Products Thermal Gap Filler

Semiconductor Automated Test Equipment Thermal Gap Filler 1.5W/MK For AI Processors AI Servers

All Products

Phase Changing Materials (39)

Thermal Conductive Pad (235)

Thermal Gap Filler (231)

Thermal Conductive Grease (28)

Thermal Insulation Materials (46)

Thermal Graphite Sheet (54)

Thermal Adhesive Tape (44)

Thermal Conductive Glue (12)

Thermal Conductive Adhesive (13)

Thermal Conductive Plastic (20)

Sponge Foam Material (10)

PET Double Sided Tape (8)

Thermal Gap Pad (403)

Thermal Conductive Gel (25)

Silicone Foam Gasket (13)

Silicone Free Gap Filler Pad (15)

Shielding Absorbing Materials (19)

Thermal Conductivity Sharp Metal (0)

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

Semiconductor Automated Test Equipment Thermal Gap Filler 1.5W/MK For AI Processors AI Servers

Large Image : Semiconductor Automated Test Equipment Thermal Gap Filler 1.5W/MK For AI Processors AI Servers

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF100-07E

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5work days
Payment Terms:	T/T
Supply Ability:	10000/day

Contact Now

Detailed Product Description

Products Name:	Semiconductor Automated Test Equipment Thermal Gap Filler 1.5W/MK For AI Processors AI Servers	Thermal Conductivity& Compostion:	1.5 W/m-K
Density(g/cm³）:	2.1	Keywords:	Thermal Gap Filler
Color:	Blue	Recommended Operating Temperature (℃):	-40 To 200℃
Hardness:	65/35 Shore 00	Application:	AI Processors AI Servers & Semiconductor Automated Test Equipment
Highlight:	high temperature phase change materials , thermal conductivity silicone , Thermal Gap Filler 1.5 W/MK

Semiconductor Automated Test Equipment Thermal Gap Filler 1.5W/MK For AI Processors AI Servers

The TIF^®100-07E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Features:

> Good thermal conductive:1.5 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Good insulation performance

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures

Typical Properties of TIF^®100-07E Series
Property	Value		Test method
Color	Green		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.1		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness (Shore 00)	65	35	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.7 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	1.5 W/m-K		ASTM D5470
	1.5 W/m-K		ISO22007

Product Specification

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm)with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).