Gray Thermal Gap Filler 13.0 W/m-K Thermal Conductive Pad For Automotive Engine Control Units

The TIF^®800QE Series is a high-end compressible thermal pad designed to meet top-level cooling requirements while ensuring excellent assembly workability. Through innovative material formulation, it achieves an ideal combination of ultra-high thermal conductivity and moderate hardness, providing efficient cooling solutions for high-power-density electronic devices.

• Excellent thermal conductivity: 13.0 W/mK
• Naturally tacky surface requiring no additional adhesive coating
• High compliance adapts to various pressure application environments
• Available in multiple thickness options

• Cooling components to chassis or frame
• High-speed mass storage drives
• Heat sinking housing for LED-lit BLU in LCD displays
• LED TV and LED lighting systems
• RDRAM memory modules
• Micro heat pipe thermal solutions
• Automotive engine control units
• Telecommunication hardware
• Handheld portable electronics
• Semiconductor automated test equipment (ATE)

Standard Thickness: 0.012" (0.30mm) ~ 0.200" (5.00mm)

Standard Size: 16" × 16" (406mm × 406mm)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Packaging Details:

• PET film or foam protection
• Paper card separation between layers
• Export carton packaging (inside and outside)
• Customized packaging available to meet customer requirements

Lead Time: Quantity (5000 pieces) - Estimated time to be negotiated

Ziitek is a manufacturer specializing in thermal interface materials including thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive interface pads, thermal grease, thermal conductive plastic, silicone rubber, silicone foams, and phase changing materials. We maintain well-equipped testing facilities and strong technical capabilities.