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ATE Heatsink Silicone Soft Compressible 15~45 Shore 00 Thermal Conductive Pad with High Thermal Conductivity 1.25W/m-K

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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ATE Heatsink Silicone Soft Compressible 15~45 Shore 00 Thermal Conductive Pad with High Thermal Conductivity 1.25W/m-K

ATE Heatsink Silicone Soft Compressible 15~45 Shore 00 Thermal Conductive Pad with High Thermal Conductivity 1.25W/m-K
ATE Heatsink Silicone Soft Compressible 15~45 Shore 00 Thermal Conductive Pad with High Thermal Conductivity 1.25W/m-K ATE Heatsink Silicone Soft Compressible 15~45 Shore 00 Thermal Conductive Pad with High Thermal Conductivity 1.25W/m-K ATE Heatsink Silicone Soft Compressible 15~45 Shore 00 Thermal Conductive Pad with High Thermal Conductivity 1.25W/m-K

Large Image :  ATE Heatsink Silicone Soft Compressible 15~45 Shore 00 Thermal Conductive Pad with High Thermal Conductivity 1.25W/m-K

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF200-02S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Detailed Product Description
Color: Various Thermal Conductivity: 1.25W/m-K
Hardness: 15~45 Shore 00 Specific Gravity: 1.75g/cc
Dielectric Constant: 5.5 MHz Continuos Use Temp: -50 To 200℃
High Light:

heatsink thermal pad

,

thermal conductive pad

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Thermal Conductive Pad 15 Shore 00

ATE Heatsink Silicone Soft Compressible Materials with High Thermal Conductivity ​

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

The TIF™200-02S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features


> Good thermal conductive: 1.25 W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> High tack surface reduces contact resistance


Applications


> Cooling components to the chassis of frame  
> Audio and video components
> Heat Sinking Housing at LED-lit BLU in LCD
> Automotive electronics
> Waterproof LED Power 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF™200 Series
Product Name TIF™200-U TIF™200-E TIF™200-S Visual Composite Thickness hermal Impedance
@10psi
(℃-in²/W)
Color Various Visual TIF™200-U TIF™200-E TIF™200-S
Construction &
Compostion
Ceramic filled silicone rubber *** 12 mils 0.304mm 0.73 0.75 0.76
20 mils 0.508mm 0.95 0.97 0.98
Specific Gravity

1.75g/cc

ASTM D297 30 mils 0.762mm 1.17 1.18 1.20
40 mils 1.016mm 1.28 1.30 1.32
Heat Capacity

1 l/g-K

ASTM C351 50 mils 1.270mm 1.47 1.49 1.52
60 mils 1.524mm 1.68 1.70 1.73
Hardness 15 25 45 ASTM 2240 70 mils 1.778mm 1.86 1.88 1.91
Shore 00 80 mils 2.032mm 2.05 2.08 2.11
Tensile Strength

425 psi

ASTM D412 90 mils 2.286mm 2.21 2.24 2.28
100 mils 2.540mm 2.37 2.40 2.44
Continuos Use Temp -50 to 200℃

***

110 mils 2.794mm 2.49 2.53 2.57
120 mils 3.048mm 2.65 2.69 2.73
Dielectric Breakdown Voltage >5500 VAC ASTM D149 130 mils 3.302mm 2.82 2.86 2.91
140 mils 3.556mm 2.95 3.00 3.05
Dielectric Constant 5.5 MHz ASTM D150 150 mils 3.810mm 3.08 3.12 3.17
160 mils 4.064mm 3.20 3.25 3.30
Volume Resistivity 4.0X10"
Ohm-meter
ASTM D257 170 mils 4.318mm 3.34 3.39 3.44
180 mils 4.572mm 3.44 3.49 3.55
Fire rating 94 V0 equivalent UL 190 mils 4.826mm 3.52 3.57 3.63
200 mils 5.080mm 3.62 3.68 3.73
Thermal conductivity 1.0 W/m-K ASTM D5470 Visua l ASTMD751 ASTM D5470
 
 
Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.
 
ATE Heatsink Silicone Soft Compressible 15~45 Shore 00 Thermal Conductive Pad with High Thermal Conductivity 1.25W/m-K 0

Advantage

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 
 
 
 
 
 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)