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3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00 TIF100-30-12E

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00 TIF100-30-12E

3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00  TIF100-30-12E
3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00  TIF100-30-12E 3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00  TIF100-30-12E 3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00  TIF100-30-12E 3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00  TIF100-30-12E

Large Image :  3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00 TIF100-30-12E

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-12E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thermal Conductivity& Compostion: 3.0W/m-K Specific Gravity: 2.85 G/cc
Heat Capacity: 1 L /g-K Color: Blue
Continuos Use Temp: -50 To 200℃ Hardness: 35 Shore 00
High Light:

thermally conductive filler

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high temperature phase change materials

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Blue thermal conductive gap filler

3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00 TIF100-30-12E

 

  The TIF100-30-12E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -50℃~200℃ and meet the requirement of UL94V0.
Features:


>  Good thermal conductive:3.0 W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF™100-30-12E Series
Color

Blue

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.80 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
35 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 ps

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>10000 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
7.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
8X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

 
Standard Thicknesses:           

0.010" (0.25mm)   0.020" (0.51mm)   0.030" (0.76mm)   0.040" (1.02mm)   0.050" (1.27mm)   0.060" (1.52mm)   0.070" (1.78mm)   
0.080" (2.03mm)   0.090" (2.29mm)    0.100" (2.54mm)   0.110" (2.79mm)   0.120" (3.05mm)   0.130" (3.30mm)   0.140" (3.56mm)      
0.150" (3.81mm)   0.160" (4.06mm)    0.170" (4.32mm)   0.180" (4.57mm)   0.190" (4.83mm)   0.200" (5.08mm)
Consult the factory alternate thickness.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
 
3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00  TIF100-30-12E 0
 
 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

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