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Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone Pads For Ssd Cpu Gpu Led Ic Chipset Cooling

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone Pads For Ssd Cpu Gpu Led Ic Chipset Cooling

Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone Pads For Ssd Cpu Gpu Led Ic Chipset Cooling

Large Image :  Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone Pads For Ssd Cpu Gpu Led Ic Chipset Cooling

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-15-11S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day
Detailed Product Description
Product Name: Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone Pads For Ssd Cpu Gpu Led Ic Chipset Cooling Thickness: Available In Varies Thicknes
Keywords: Thermal Silicone Pads Construction & Compostion: Ceramic Filled Silicone Rubber
Application: Ssd Cpu Gpu Led Ic Chipset Cooling Specific Gravity: 2.3 G/m³
Hardness: 45/65 Shore 00 Color: Dark Gray
Continuos Use Temp: -40 To 200℃
Highlight:

thermally conductive filler

,

thermal conductivity silicone

,

cpu thermal conductive silicone pad

Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone Pads For Ssd Cpu Gpu Led Ic Chipset Cooling

 

The TIF®100-15-11S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:


> Good thermal conductive: 1.5 W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized


Applications:


> Cooling components to the chassis of frame  
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply

 

Typical Properties of TIF®100-15-11S Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5 W/m-K ASTM D5470
1.5 W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone Pads For Ssd Cpu Gpu Led Ic Chipset Cooling 0

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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