Send Message
Home ProductsPhase Changing Materials

CPU Gray Insulated Phase ChangingThermal Conductivity Materials PCM 2.5W/mK T-PCM T725 T558 HI-flow PCS Kenflow

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

CPU Gray Insulated Phase ChangingThermal Conductivity Materials PCM 2.5W/mK T-PCM T725 T558 HI-flow PCS Kenflow

CPU Gray Insulated Phase ChangingThermal Conductivity Materials PCM 2.5W/mK  T-PCM T725 T558  HI-flow PCS Kenflow
CPU Gray Insulated Phase ChangingThermal Conductivity Materials PCM 2.5W/mK  T-PCM T725 T558  HI-flow PCS Kenflow
video play

Large Image :  CPU Gray Insulated Phase ChangingThermal Conductivity Materials PCM 2.5W/mK T-PCM T725 T558 HI-flow PCS Kenflow

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC800A series
Payment & Shipping Terms:
Minimum Order Quantity: 1000PC
Price: USD 0.03PCS
Packaging Details: 1000PCS/bag
Delivery Time: 2-3Works
Supply Ability: 100000PCS/DAY
Detailed Product Description
Product Name: Phase Changing Materials Color: Gray
Thermal Conductivity: 2.5 W/mK Phase Change Softening Temperature: 50℃~60℃
Work Temperature: -25℃~125℃ Phase Transition Temperature: 50℃~60℃
High Light:

thermal insulating materials

,

heat sensitive materials

,

Thermal Conductivity Materials 2.5W/mK

CPU Gray Insulated Phase ChangingThermal Conductivity Materials PCM 2.5W/mK T-PCM T725 T558 HI-flow PCS Kenflow

 

 

The TIC™800A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. 


The TIC™800A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 

 

TIC800A Series Datasheet-(E)-REV01.pdf


Features:


> 0.020℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required             
> No heat sink preheating required 


Applications:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

>Telecommunication 

 

 

Typical Properties of TIC™800A Series
Product Name
TICTM803A
TICTM805A
TICTM808A
TICTM810A
Testing standards
Color
Ashy
Ashy
Ashy
Ashy
Visual
Composite Thickness
0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.5g/cc
  Helium   Pycnometer
Work Temperature
-25℃~125℃
 
phase transition  temperature
50℃~60℃
 
Thermal conductivity
2.5 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa)
0.018℃-in²/W
0.020℃-in²/W
0.047℃-in²/W
0.072℃-in²/W
ASTM D5470 (modified)
0.11℃-cm²/W
0.13℃-cm²/W
0.30℃-cm²/W
0.46℃-cm²/W
 
 
Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)            
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.
 
CPU Gray Insulated Phase ChangingThermal Conductivity Materials PCM 2.5W/mK  T-PCM T725 T558  HI-flow PCS Kenflow 0
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

 

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)