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High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management

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High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management

High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management
High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management
High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management

Large Image :  High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-05E
Document: TIF100-30-05E_Data-sheet..pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 100000pcs/day
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High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management

Description
Products Name: High Thermal Conductivity Silicone Thermal Pad Supplier 3.0W/MK Blue Thermal Gap Filler Pad For AI Server Thermal Management Color: Blue
Thickness: 0.010~0.200"/(0.25~5.00mm) Hardness(Shore 00): 65/35
Fire Rating: 94-V0 Keywords: Thermal Pad Supplier
Thermal Conductivity: 3.0W/m.K Application: AI Server Thermal Management
Highlight:

blue silicone thermal pad 3.0W/MK

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High Thermal Conductivity Silicone Thermal Pad - 3.0W/MK Blue Thermal Gap Filler Pad for AI Server Thermal Management
Product Overview

TIF®️100-30-05E Series is a well-balanced, general-purpose thermal pad offering excellent thermal conductivity and moderate hardness. This balanced design provides both superior surface conformity and ease of use, making it capable of effectively transferring heat while providing basic physical protection for electronic components. Ideal for medium to high power heat dissipation applications, it achieves the optimal balance between cost and performance.

Key Features
  • High thermal conductivity (3.0 W/m·K)
  • Excellent softness and gap-filling capability
  • Self-adhesive - no additional surface adhesives required
  • High insulation performance
Applications
  • Power Electronics
  • Automotive Electronics
  • Consumer Electronics
  • Industrial Control Systems
  • New Energy Applications
  • AI Server Thermal Management
  • Power Tools
  • Network Communication Products
  • Electric Vehicle Batteries
  • Computer CPU/GPU Cooling
  • New Energy Vehicle Power Systems
Technical Specifications - TIF®100-30-05E Series
Property Value Test Method
Color (Silicone Cloth/Silicone) Blue Visual
Construction Ceramic filled silicone elastomer ZKTM J024
Density (g/cm³) 3.0 ASTM D792
Thickness Range (inch/mm) 0.010"~0.020" (0.25mm~0.50mm) / 0.030"~0.200" (0.75~5.00mm) ASTM D374
Hardness (Shore 00) 65/35 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ZKTM J025
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity (Ohm-meter) ＞1.0×10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 3.0 ASTM D5470
Product Specifications

Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm), with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF®️ series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®100-30-05E Series High Thermal Conductivity Silicone Thermal Pad
Why Choose Ziitek?
  • Our value message: "Do it right the First time, total quality control"
  • Core competencies in thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and business secret contracts
  • Free sample offers
  • Quality assurance contracts
Frequently Asked Questions
What is a Thermal Interface Material (TIM)?
TIM (Thermal Interface Material) refers to a class of materials used to fill microscopic air gaps between a heat source and a heat sink. TIMs help reduce interface thermal resistance and improve heat transfer from the heat source to the cooling structure. Common TIMs include thermal pads, thermal gels, thermal greases, phase change materials (PCMs), and liquid metal.
What is Thermal Conductivity?
Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m·K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.
What is Thermal Resistance?
Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.
What is the difference between Thermal Conductivity and Thermal Resistance?
Thermal conductivity primarily reflects the intrinsic heat-conduction capability of a material, while thermal resistance is also affected by factors such as thermal conductivity, material thickness, contact area, and interface conditions. In practical applications, it is important to consider not only thermal conductivity but also the overall thermal resistance of the TIM layer.
Does higher thermal conductivity always mean better cooling performance?
Not necessarily. Actual cooling performance is also affected by material thickness, interface contact, compression properties, contact area, heat source power, and heat sink design. Therefore, when selecting a TIM, both thermal conductivity and actual thermal resistance should be evaluated.

Overall Rating

5.0
Based on 50 reviews for this supplier

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Helpful (8)
15.0W/mK High thermal conductive RoHS compliant UL recognized Manufacturer
Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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