High Thermal Conductivity 3.0W/mK Silicone Thermal Pad Suitable For Heat Sink Applications And Thermal Management Systems

Name: High Thermal Conductivity 3.0W/mK Silicone Thermal Pad Suitable For Heat Sink Applications And Thermal Management Systems
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd
SKU: TIF200-30-12
Price: 5.03 USD
Availability: InStock

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High Thermal Conductivity 3.0W/mK Silicone Thermal Pad Suitable For Heat Sink Applications And Thermal Management Systems

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Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF200-30-12
Document:	TIF200-30-50S_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-7 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/day

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High Thermal Conductivity 3.0W/mK Silicone Thermal Pad Suitable For Heat Sink Applications And Thermal Management Systems

Description

Products Name:	High Thermal Conductivity 3.0W/mK Silicone Thermal Pad Suitable For Heat Sink Applications And Thermal Management Systems	Color:	Pink
Thickness:	0.010(0.25mm)~0.020"~0.200(0.50~5.00mm)	Hardness:	70/45 Shore 00
Fire Rating:	94-V0	Keywords:	Silicone Thermal Pad
Thermal Conductivity:	3.0W/m.K	Application:	Heat Sink Applications And Thermal Management Systems
Highlight:	3.0W/mK silicone thermal pad , thermal pad for heat sink , thermal gap filler with warranty

High Thermal Conductivity 3.0W/mK Silicone Thermal Pad Suitable for heat sink applications and thermal management systems

Product Overview

The TIF^®200-30-50S Series is a compound thermal interface material that combines high thermal conductivity, reliable electrical insulation, and soft characteristics. This product not only provides high thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation, such as power devices, new energy vehicles, and portable electronic devices.

Key Features

High thermal conductivity
Good softness and fillability
Self-adhesive without the need for additional surface adhesives
High insulation performance
Puncture-resistant, tear-resistant, and scratch-resistant performance

Applications

Power Electronics
Automotive Electronics
Consumer Electronics
Industrial Control
New Energy
AI server
Medical equipment
Unmanned aerial vehicle (UAV)
Robot
Wireless Charger

Technical Specifications - TIF^®200-30-50S Series

Property	Value	Test Method
Color (Silicone Cloth/Silicone)	Pink	Visual
Construction	Ceramic filled silicone elastomer	ZKTM J024
Density (g/cm³)	3.0	ASTM D792
Thickness Range (inch/mm)	0.010" (0.25mm) / 0.020"~0.200" (0.50~5.00mm)	ASTM D374
Hardness (Shore 00)	70/45	ASTM 2240
Recommended Operating Temperature	-40 to 200℃	ZKTM J025
Breakdown Strength (V/mm)	≥5500	ASTM D149
Dielectric Constant @1MHz	4.5	ASTM D150
Volume Resistivity (Ohm-meter)	＞1.0×10¹²	ASTM D257
Flame rating	V-0	UL 94 (E331100)
Thermal conductivity (W/m-K)	3.0	ASTM D5470

Product Specifications

Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm), with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Why Choose Ziitek?

Our value message: "Do it right the First time, total quality control"
Core competencies in thermal conductive interface materials
Competitive advantage products
Confidentiality agreement and business secret contracts
Free sample offers
Quality assurance contracts

Frequently Asked Questions

Q: What is a Thermal Silicone Pad?

A: A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.

Q: What are the advantages of Thermal Silicone Pads?

A: Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.

Q: Is a thinner Thermal Silicone Pad always better?

A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.

Q: Can Thermal Silicone Pads have an adhesive backing?

A: Some thermal silicone pads can be supplied with single-sided or double-sided adhesive backing. The adhesive is mainly used to assist with material positioning and installation. The appropriate adhesive should be selected according to the operating temperature and application environment.

Q: How much compression is required for a Thermal Silicone Pad?

A: The optimal compression range varies depending on the material. It should be determined based on the pad's hardness, thickness, and product structure. A single fixed compression ratio should not be applied to all thermal pad applications.

Overall Rating

5.0

Based on 50 reviews for this supplier

Rating Snapshot

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All Reviews

Dante

Poland Jul 20.2026

Helpful (6)

These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.

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