Thermal Gap Filler Combining Flexibility Elasticity And High Thermal Conductivity For Optimal Thermal Management Solutions

Name: Thermal Gap Filler Combining Flexibility Elasticity And High Thermal Conductivity For Optimal Thermal Management Solutions
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd
SKU: TIF200-30-12
Price: 5.03 USD
Availability: InStock

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The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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Thermal Gap Filler Combining Flexibility Elasticity And High Thermal Conductivity For Optimal Thermal Management Solutions

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Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF200-30-12
Document:	TIF200-30-12S_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-7 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/day

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Thermal Gap Filler Combining Flexibility Elasticity And High Thermal Conductivity For Optimal Thermal Management Solutions

Description

Products Name:	Thermal Gap Filler Offering High Thermal Conductivity And Natural Tackiness For Easy Installation In Thermal Interfaces	Color:	Yellow/Blue
Thickness:	0.010~0.200"(0.25~5.00mm)	Hardness:	45/70 Shore 00
Fire Rating:	94-V0	Keywords:	Thermal Gap Filler
Application:	Automotive Electronics	Thermal Conductivity:	3.0W/m.K
Highlight:	flexible thermal gap filler , elastic thermal gap filler , high thermal conductivity gap filler

Thermal Gap Filler Combining Flexibility, Elasticity and High Thermal Conductivity

Product Overview

The TIF®200-30-12S Series is a compound thermal interface material that combines excellent thermal conductivity, reliable electrical insulation, and soft characteristics. This product provides superior thermal performance while ensuring exceptional breakdown voltage strength to prevent circuit short circuits. Its soft characteristics allow complete filling of uneven interfaces, providing excellent cushioning protection for precision components while effectively dissipating heat. This series is ideal for applications requiring electrical isolation, including power devices, new energy vehicles, and portable electronic devices.

Key Features

Excellent thermal conductivity
Superior softness and fillability
Self-adhesive without additional surface adhesives
Reliable insulation performance
Puncture-resistant, tear-resistant, and scratch-resistant

Applications

Power Electronics
Automotive Electronics
Consumer Electronics
Industrial Control
New Energy

Technical Specifications - TIF®200-30-12S Series

Property	Value	Test Method
Color	Yellow/blue	Visual
Construction	Ceramic filled silicone elastomer	ZKTM J024
Density (g/cm³)	3.0	ASTM D792
Thickness Range (inch/mm)	0.010" (0.25 mm) ~ 0.200" (5.00 mm)	ASTM D374
Hardness (Shore 00)	45/70	ASTM 2240
Recommended Operating Temperature	-40 to 200℃	ZKTM J025
Breakdown Strength (V/mm)	≥5500	ASTM D149
Dielectric Constant @1MHz	4.5	ASTM D150
Volume Resistivity (Ohm-meter)	＞1.0×10¹²	ASTM D257
Flame rating	V-0	UL 94 (E331100)
Thermal conductivity (W/m-K)	3.0	ASTM D5470

Product Specifications

Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm), with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®200-30-12S Series Thermal Gap Filler product demonstration

Why Choose Ziitek?

Our value message: "Do it right the First time, total quality control"
Core competencies in thermal conductive interface materials
Competitive advantage products
Confidentiality agreement and business secret contracts
Free sample offers
Quality assurance contracts

Frequently Asked Questions

Q: What is a Thermal Silicone Pad?

A: A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.

Q: What are the advantages of Thermal Silicone Pads?

A: Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.

Q: Is a thinner Thermal Silicone Pad always better?

A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.

Q: What are the common thicknesses of Thermal Silicone Pads?

A: Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.

Q: Can Thermal Silicone Pads be customized in size?

A: Yes. Thermal silicone pads can be customized according to the customer's product structure, including length, width, thickness, and complex shapes. Die-cutting, punching, and other processing methods can also be used to produce customized parts.

Overall Rating

5.0

Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings

5 stars

100%

4 stars

3 stars

2 stars

1 stars

All Reviews

Dante

Poland Jul 20.2026

Helpful (6)

These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.

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