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High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics

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China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics

High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics
High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics

Large Image :  High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF040-49
Document: TIF040-49_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000 tubes
Price: Negotiation
Packaging Details: 30 cc/pcs，50cc/pcs
Delivery Time: 7-15work days
Payment Terms: T/T
Supply Ability: 10000/day
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High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics

Description
Name: High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics Application: AI Server & Automotive Electronics
Color: Pink Continuous Use Temp: -40-200 ℃
Keywords: Thermal Conductive Gel Density(g/cm³): 3.15
Thermal Conductivity: 4.0 W/mK Flame Rating: UL94 V-0
Construction: Ceramic Filled Silicon Material
Highlight:

High thermal conductivity gap filler

,

Thermal conductive gel for AI server

,

Automotive electronics thermal gel

High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics
Product Overview

TIF®040-49 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance.It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.

Key Features
  • High Thermal conductivity
  • Soft, very low compression
  • Ultra thin interface
  • Operate automatically
  • Long-term reliability
Applications
  • Heat-sink & frame
  • LED backlight module, LED lighting
  • High speed hardware driver
  • Micro heat pipe radiator
  • Vehicle engine controller
  • Communication hardware
  • Semiconductor automatic laboratory equipment
Technical Specifications of TIF®️040-49
Property Value Test Method
Color Pink Visual
Construction Ceramic filled silicon material ZKTM J024
Flow Rate (g/min)
(30cc syringe/ 2.5mm orifice/90 psi)		 130 ZKTM B014
Density (g/cm³) 3.15 ASTM D792
Thermal conductivity (W/mK) 4.0 ASTM D5470
Thermal impedance (℃-in²/W) @10psi 0.109 ASTM D5470
Thermal impedance (℃-in²/W) @50psi 0.093 ASTM D5470
Recommended Operating Temperature -40~200℃ ZKTM J025
Breakdown Strength (V/mm) ≥1500 ASTM D149
Bond Line Thickness (mm) 0.13 ZKTM B047
Flame Rating V-0 UL 94
Volatility Loss (%) @150°C, 24 hrs ＜1 HG/T 2502
Product Specifications

30cc/pcs, 50cc/pcs, 300 cc/pc, or custom packaging for automated applications.

For more information about thermal conductive materials, please contact our company.

High Thermal Conductivity Gap Filler Thermal Conductive Gel product image
Our Services
  • Online-service: 12 hours, Inquiry reply within fastest
  • Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
  • Well-trained & experienced staff are to answer all your inquiries in English
  • Standard Export Carton Or Marked With Customer's Information Or Customized
  • Provide free samples
  • After-service: Even our products have passed strict inspection, if you find the parts cannot work well, please show us the proof. We will help you to deal with it and give you satisfactory solution
Frequently Asked Questions
Q: What is Thermal Gel?
A: Thermal gel is a TIM (Thermal Interface Material) with good flowability and gap-filling capability. It can be applied through dispensing, coating, or other application methods to fill gaps between heat sources and cooling structures.
Q: What is the main advantage of Thermal Gel?
A: The main advantage of thermal gel is its ability to adapt to complex structures and irregular gaps. It is particularly suitable for applications where multiple components with different heights need to be thermally managed simultaneously.
Q: What size gap is Thermal Gel suitable for?
A: The applicable gap range varies depending on the specific thermal gel. It should be determined based on the product's flowability, curing characteristics, and assembly structure.
Q: Will Thermal Gel flow or leak?
A: Different thermal gels have different rheological properties. During engineering design, factors such as high-temperature sag, flow behavior, and long-term stability should be evaluated to ensure reliable performance.
Q: Does Thermal Gel need to be cured?
A: It depends on the product type. Some thermal gels are non-curing, while others are designed to cure after application. The appropriate type should be selected according to the customer's production process and operating environment.
Q: What is the difference between Thermal Gel and Thermal Grease?
A: Thermal gel generally provides better gap-filling and shape-retention capabilities, while thermal grease is primarily used for very thin interface layers. The appropriate choice depends on the required gap, assembly conditions, and long-term reliability requirements.
Q: Can Thermal Gel be used in battery packs?
A: Yes. Thermal gel can be applied between battery cells, modules, cooling structures, and other components requiring thermal management. The selected product should meet the battery pack's requirements for electrical insulation, flame resistance, temperature resistance, and long-term reliability.
Q: Is Thermal Gel suitable for AI servers?
A: Yes. For GPUs, CPUs, power components, and other components with significant height differences or complex structures, thermal gel provides excellent gap-filling capability and can help improve thermal transfer.

Tag:

thermally conductive putty,

thermal putty,

electrically conductive putty

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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