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Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics

Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics

Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics
Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-15U
Document: TIF100-30-15U_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day

Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics

Description
Products Name: Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics Thickness: 0.25~5.0mmT
Thermal Conductivity: 3.0W/m-K Hardness: 65/27 Shore00
Density: 3.0g/cm³ Keywords: Thermal Pad
Application: Electronics Sample: Sample Available
Highlight:

Thermal conductive pad super soft

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Thermal conductive pad highly compliant

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Thermal conductive pad 2W/mK conductivity

Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics
Product Overview

TIF®100-30-15U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Key Features
  • High thermal conductivity
  • Super soft and highly compliant
  • Self-adhesive without the need for additional surface adhesives
  • Good insulation performance
Applications
  • Mainboard/mother board
  • Notebook
  • Power supply
  • Heat pipe thermal solutions
  • Memory Modules
  • Mass storage devices
  • Set top boxes
  • Audio and video components
  • Power tools
  • Network communication products
  • Electric vehicle batteries
  • Computer CPU/GPU Cooling
  • New energy vehicle power systems
Technical Specifications of TIF®100-30-15U Series
Property Value Test Method
Color Purple Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 3.0 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 65 | 27 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1Mhz 7.0 ASTM D150
Volume Resistivity (Ohm-cm) >1.0×10¹² ASTM D257
Thermal Conductivity (W/m-K) 3.0 ASTM D5470
ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes
  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF Thermal Conductive Pad product photo showing purple thermal interface material
Packaging & Lead Time

Packaging Details:

  • With PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging to meet customer requirements

Lead Time:

Quantity: 5000 pieces

Estimated Time: To be negotiated

Company Profile

Ziitek, founded in 2006 and headquartered in Dongguan, Guangdong Province, is the world's leading manufacturer of thermal interface materials and thermal management solutions. After years of technical development, the company has built a complete product matrix including thermal interface materials, EMI shielding materials, heating products, foamed silica gel sealing rings, and heat conduction engineering plastics. With production bases in Kunshan, Taiwan Province and Vietnam, we provide one-stop thermal management solutions for customers worldwide.

Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer in China and Vietnam.
How long is your delivery time?
Generally 3-7 work days if goods are in stock, or 7-10 work days if not in stock, depending on quantity.
Do you provide samples? Is it free or extra cost?
Yes, we offer samples free of charge.
What is a Thermal Silicone Pad?
A thermal silicone pad is a pre-formed thermal interface material typically made of silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks and can provide electrical insulation depending on the formulation.
What are the advantages of Thermal Silicone Pads?
Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. They can be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.
Is a thinner Thermal Silicone Pad always better?
Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on actual structural tolerances and application requirements.

Overall Rating

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S
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Israel Jun 22.2026
15.0W/mK High thermal conductive RoHS compliant UL recognized Manufacturer
Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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