Excellent Thermal Conductivity Phase Change Thermal Paste For Automotive Electronics And New Energy Electronic Control System

TIC^®800R-SP is a paste-like thermal phase change material that undergoes phase transition at operating temperature, fully filling the micro voids at the contact interface to significantly improve thermal conductivity efficiency. The material features a sturdy polymer phase change structure with excellent wetting properties within typical operating temperature ranges, forming close contact with various substrate surfaces to achieve extremely low surface contact resistance.

The product has undergone rigorous long-term reliability testing and maintains stable thermal conductivity and physical properties under high temperature, high humidity, temperature cycling, and other working conditions, meeting the strict requirements of high-performance electronic devices for long-term stability.

• Excellent thermal conductivity
• Excellent surface wettability
• Outstanding operability and repairability
• Low thermal resistance
• No need for heating and curing, suitable for automated dispensing processes

• Automotive Electronics and New Energy Electronic Control System
• IT/Enterprise
• Power Semiconductor Devices and Modules
• Consumer Electronics
• Server and data center equipment

Available in 30ml/pcs and 50ml/pcs packaging. For product information of different specifications, please contact our company.

If you would like to know more product information about thermal conductive materials, please visit our official website.