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| Products Name: | Good Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers | Thickness: | Available In Varies Thicknes |
|---|---|---|---|
| Keywords: | Thermally Gap Pad Filler | Hardness: | 35 Shore 00 |
| Construction & Compostion: | Ceramic Filled Silicone Elastomer | Specific Gravity: | 3.3 G/cc |
| Flame Rating: | 94 -V0 | Thermal Conductivity: | 5.0 W/mK |
| Application: | AI Processors AI Servers |
Good Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers
TIF®100-50-50E Series is a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Features:
> Good thermal conductive:5.0W/mK
> Available in varies thickness
> Good flexibility and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications:
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> AI Processors AI Servers
| Typical Properties of TIF®100-50-50E Series | |||
| Property | Value | Test method | |
| Color | Pink | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.3 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.5) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 9.0MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | |
| 5.0 W/m-K | ISO22007 | ||
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
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Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Contact Person: Dana Dai
Tel: 18153789196