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Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation

Large Image : Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF200-10-02ES

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/day

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Detailed Product Description

Products Name:	Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation	Hardness:	10 Shore 00
Application:	Semiconductor Heat Dissipation	Thermal Conductivity:	1.0W/m-K
Color:	Pink/ White	Continuous Use Temp:	-40 To 200℃
Sample:	Sample Free	Thickness:	0.010"(0.25mm)~0.200"(5.0mm)
Keywords:	Silicone Thermal Pad
Highlight:	1.5W/M.K thermal gap filler , high conductive silicone rubber pad , semiconductor heat dissipation pad

Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation

The TIF^®200-10-02ES Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation,such as power devices,new energy vehicles,and portable electronic devices.

Features

> Good thermal conductive: 1.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating
> High durability

Applications

Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

Typical Properties of TIF^®200-10-02ES Series
Property	Value		Test method
Color	Pink/White		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.8		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	10 Shore 00	10 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥ 5500		ASTM D149
Dielectric Constant	5.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Thermal Conductivity (W/m-K)	1.0		ASTM D5470
	1.0		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Tag:

Contact Person: Dana Dai

Tel: +86 18153789196

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Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation

Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation

1.5W/M.K thermal gap filler

high conductive silicone rubber pad

semiconductor heat dissipation pad

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials