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Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance

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Certification
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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance

Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance
Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance
Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance

Large Image :  Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-10-01U Series
Document: TIF100-10-01U_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day
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Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance

Description
Products Name: Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance Continuos Use Temp: -40℃ To 200℃
Density: 2.0g/cm³ Application: Laptop Desktop GPU Computer Cooling
Hardness: 65/27 Shore 00 Keywords: Thermal Silicone Insulation Pad
Color: Black Thermal Conductivity& Compostion: 1.0W/m-K
Thickness: 0.010~0.20inch / 0.25~5.0mmT Construction: Ceramic Filled Silicone Elastomer
Highlight:

thermal silicone insulation pad for GPU

,

CPU cooling pad with low thermal resistance

,

thermal conductive pad 0.5MM-5.0MM

Thermal Silicone Insulation Pad For GPU CPU Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance
Product Overview

TIF®100-10-01U Series is recommended for applications requiring minimal pressure on components. The viscoelastic material provides excellent low-stress vibration dampening and shock absorption characteristics. This electrically isolating material is ideal for applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Key Features
  • Excellent thermal conductivity: 1.0W/mK
  • Soft and compressible for low stress applications
  • Naturally tacky - no additional adhesive required
  • Available in various thicknesses
  • Broad range of hardness options
  • Moldable for complex parts
  • Outstanding thermal performance
Applications
  • Heat dissipation structure for radiators
  • Telecommunication equipment
  • Automotive electronics
  • Battery packs for electric vehicles
  • LED TV and lamps
  • Telecommunication hardware
  • Handheld portable electronics
  • Power supply systems
  • Heat pipe thermal solutions
  • Memory Modules
  • Mass storage devices
  • Set top boxes
Technical Specifications - TIF®100-30-06S Series
Property Value Test Method
Color Black Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.0 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.0		 ASTM D374
Hardness (Shroe 00) 65 | 27 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity ＞1.0×10¹² Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.0 W/m-K ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Thermal Silicone Insulation Pad product photo
Packaging & Lead Time

Packaging Details:

  • PET film or foam protection
  • Paper card separation between layers
  • Export carton packaging (inside and outside)
  • Customized packaging available per customer requirements

Lead Time:

Quantity: 5000 pieces

Estimated Time: To be negotiated

Company Profile

Ziitek is a high-tech enterprise dedicated to the R&D, manufacturing, and sales of thermal interface materials (TIMs). With extensive experience in the field, we provide the latest, most effective thermal management solutions. Our advanced production equipment, comprehensive testing facilities, and fully automatic coating production lines support high-performance manufacturing of thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, thermal grease, and more. All products comply with UL94 V-0, SGS, and ROHS standards.

Certifications
  • ISO9001:2015
  • ISO14001:2004
  • IATF16949:2016
  • IECQ QC 080000:2017
  • UL Certified
Why Choose Ziitek?
  • Our value message: "Do it right the First time, total quality control"
  • Core competency: Thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and business secret contracts
  • Free sample offerings
  • Quality assurance contracts

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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