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Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU

Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-10-01U
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Detailed Product Description
Products Name: Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation Silicone Pad For CPU Materails: Ceramic Filled Silicone Elastomer
Thermal Conductivity: 1.0W/m-K Hardness: 27 Shore 00
Specific Gravity: 2.1 G/cc Dielectric Constant: 4.5 MHz
Fire Rating: 94-V0 Keywords: Thermal Conductive Silicone Pad
Highlight:

Heat Dissipation Silicon Thermal Pad

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Customized Thermal Conductive Silicone Pad

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CPU Thermal Conductive Silicone Pad

Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation Silicone Pad For CPU​

 

The TIF100-10-01U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

TIF100-10-01U-TDS_EN_REV02-.pdf

Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU 0
Features:

>  Good thermal conductive: 1.5 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness

> Easy release construction
> Electrically isolating
> High durability

 


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  CPU
> Display card
> Mainboard/mother board

 

Typical Properties of TIF100-10-01U Series
Color Dark gray Visual
Construction &Compostion Ceramic filled silicone elastomer ***
Specific Gravity 2.1g/cc ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ASTM C351
Hardness 27 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5000 VAC ASTM D412
Continuos Use Temp -40 to 160℃ ***
Outgassing(TML) 0.35% ASTM E595
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 1.0W/m-K ASTM D5470

Standard Thicknesses:           
0.010" (0.25mm),0.020" (0.51mm),0.030" (0.76mm) ,0.040" (1.02mm),

0.050" (1.27mm),0.060" (1.52mm),0.070" (1.78mm),0.080" (2.03mm),

0.090" (2.29mm),0.100" (2.54mm),0.110" (2.79mm),0.120" (3.05mm),

0.130" (3.30mm),0.140" (3.56mm),0.150" (3.81mm),0.160" (4.06mm),

0.170" (4.32mm),0.180" (4.57mm),0.190" (4.83mm),0.200" (5.08mm)
Consult the factory alternate thickness.


Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU 1
 
Company profile
 
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
 

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)