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Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU

Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU

Large Image :  Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-10-01U
Document: TIF100-10-01U_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Payment Terms: T/T
Supply Ability: 100000pcs/day
Contact Now

Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU

Description
Products Name: Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation Silicone Pad For CPU Materails: Ceramic Filled Silicone Elastomer
Thermal Conductivity: 1.0W/m-K Hardness: 27/65 Shore 00
Specific Gravity: 2.0 G/cm³ Dielectric Constant: 4.5 MHz
Fire Rating: 94-V0 Keywords: Thermal Conductive Silicone Pad
Highlight:

Heat Dissipation Silicon Thermal Pad

,

Customized Thermal Conductive Silicone Pad

,

CPU Thermal Conductive Silicone Pad

Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Product Overview

The TIF®100-10-01U Series thermally conductive interface materials are applied to fill the air gaps between heating elements and heat dissipation fins or metal bases. Their flexibility and elasticity make them ideal for coating uneven surfaces. Heat can transmit to metal housing or dissipation plates from separate elements or entire PCBs, effectively enhancing the efficiency and lifespan of heat-generating electronic components.

Key Features
  • Good thermal conductivity: 1.5 W/mK
  • Naturally tacky - no additional adhesive coating required
  • Soft and compressible for low stress applications
  • Available in various thicknesses
  • Easy release construction
  • Electrically isolating
  • High durability
Applications
  • Cooling components to chassis or frame
  • High speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • CPU
  • Display card
  • Mainboard/motherboard
Technical Specifications
Property Value Test Method
Color Black Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.0 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.0		 ASTM D374
Hardness (Shroe 00) 65 | 27 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MH 4.5 ASTM D150
Volume Resistivity ＞1.0*10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.0 W/m-K
1.0 W/m-K		 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"*16" (406 mm*406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Thermal Conductive Silicone Pad Product Image
Company Profile

Ziitek Electronic Material and Technology Ltd. is an R&D and production company with multiple production lines and processing technologies for thermal conductive materials. We own advanced production equipment and optimized processes, providing various thermal solutions for different applications.

Frequently Asked Questions
Q: Are you a trading company or manufacturer?
A: We are a manufacturer in China.
Q: How long is your delivery time?
A: Generally 3-7 work days if goods are in stock, or 7-10 work days if not in stock, depending on quantity.
Q: Do you provide samples? Is it free or extra cost?
A: Yes, we offer samples free of charge.

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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