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Products Name: | China Manufacturer Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad | Keywords: | Thermal Pads |
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Application: | Gpu Cpu Led Heat Dissipation | Density: | 2.3g/cc |
Hardness: | 45 Shore 00 | Color: | Gray |
Thermal Conductivity& Compostion: | 1.0W/m-K | Thickness: | 0.020~0.20inch / 0.5~5.0mmT |
Construction: | Ceramic Filled Silicone Elastomer | Continuos Use Temp: | -40℃ To 160℃ |
China Manufacturer Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 to 5.0mm Thermal gap filler pad
Product description
TIF100-10-02S Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features
> Excellent thermal conductivity: 1.0W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> RoHS compliant
> UL recognized
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
Typical Properties of TIF100-10-02S Series | ||
Property | Value | Test method |
Color | Gray | Visual |
Construction &Compostion | Ceramic filled silicone elastomer | ***** |
Specific Gravity | 2.3 g/cc | ASTM D297 |
Hardness | 45 Shore 00 | ASTM 2240 |
Continuos Use Temp | -40 to 160℃ | ***** |
Dielectric Breakdown Voltage(T-1.0mm) | >5500 VAC | ASTM D149 |
Dielectric Constant @ 1MHz | 4.5 | ASTM D150 |
Volume Resistivity | 1.0x1012 Ohm-meter | ASTM D257 |
Flame rating | 94 V0 | UL E331100 |
Thermal conductivity | 1.0 W/m-K | ASTM D5470 |
Outgassing(TML) | 0.35% | ASTM E595 |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied.Please contact us for confirming.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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Contact Person: Dana Dai
Tel: 18153789196