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Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment

Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment
Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment
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Large Image :  Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100N-25-16S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment Thermal Conductivity& Compostion: 2.5 W/m-K
Specific Gravity: 1.6g/cc Hardness: 45 Shore 00
Color: Blue-Violet Thickness: 0.020"(0.50mm)~0.200"(5.00mm)
Continuos Use Temp: -40℃ To 200℃ Application: Electronic Equipment
Keywords: Thermal Gap Filler Pad Construction: Boron Nitride-Filled Silicone Rubber
Highlight:

Soft 2.5W Silicone Thermal Pad

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Electronic Equipment Silicone Thermal Pad

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Thermal Conductive Gap Filler Pad

Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment

 

TIF®100N-25-16S series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.

 

Features:
> Excellent thermal conductivity 2.5W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure
> Available in different thickness options

> Easy release construction
> Electrically isolating
> High durability


Applications:

> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)

> Industrial equipment
> Network communication devices

> New energy vehicles
>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules

 

Typical Properties of TIF®100N-25-16S Series
Color Blue-Violet Visual
Construction & Compostion Boron Nitride-Filled Silicone Rubber *****
Specific Gravity 1.6 g/cc ASTM D792
thickness 0.020"(0.5mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 45 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 2.8 MHz ASTM D150
Fire rating 94 V0 UL (E331100)
Thermal conductivity 2.5 W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.020"(0.50mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Premium Soft 2.5W Silicone Thermal Pad Thermal Conductive Gap Filler Pad For Electronic Equipment 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)