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High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

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High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment
High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

Large Image :  High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TS-TIR700-25
Payment & Shipping Terms:
Minimum Order Quantity: 1000PCS
Price: 0.1-10 USD/PCS
Packaging Details: 1000pcs/bag
Delivery Time: 2-3 work days
Supply Ability: 100000pcs/day
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Detailed Product Description
Product Name: High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment Material: Carbon Fiber Filled Silicone
Density: 2.9g/cm³ Thermal Conductivity (Z Axis Direction): 25.0W/m-K
Hardness: 85±5 /60±10 Shore 00 Application: 5G Communication Equipment
Keywords: Thermal Pad Color: Gray
Highlight:

25w/MK Carbon Based Thermal Sheet

,

Carbon Based Thermal Pad

,

Thermal Pad For 5G Communication Equipment

High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

 

TS-TIR®700-25 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.

 

Feature

>Good thermal conductivity 25w/mK

>Ultra-low thermal resistance
>works under low pressure.

>Non-insulating material

>Non-adhesive surface

 

Application

>Between chips and heat dissipation modules

>5G communication equipment
>Optoelectronics industry

>Wearable devices

Typical Properties of TIR®700-25 series
Product Name TIR®700-25 Test Method
Colour Gray Visual
Construction Carbon fiber filled silicone *****
Thickness range 0.01"~0.02" (0.3~0.5 mm) 0.04"~0.20"(1.0~5.0 mm) ASTM D374
Hardness 85±5 Shore 00 60±10 Shore 00 ASTM D2240
Density 2.9g/cm3 ASTM D792
Operation Temperature -40℃~ 200℃ ******
Thermal impedance 25.0W/m-K ASTM D5470
Specific heat capacity (J/g ℃) 0.75 ASTM E1269 @25℃
Flame Rating V-0 UL94
RoHS Compliant IEC62321

Product Specification
Standard Thickness:0.01" (0.3mm), 0.02"(0.5mm), 0.04"(1.0mm), 0.06" (1.5mm), 0.08" (2.0mm), 0.10" (2.5mm), 0.12" (3.0mm)

Standard Size: 1.97"×1.97"(50.0mm x 50.0mm)

 

 
High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment 0

Packaging Details & Lead time

 

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Tag:

pyrolytic graphite sheet,

thin graphite sheet,

thermal conductivity graphite

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)

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