|
Product Details:
Payment & Shipping Terms:
|
Name: | Factory 8W/mk Thermally Silicone Pad For AI | Applications: | CPU PC GPU |
---|---|---|---|
Material: | Ceramic Filled Silicone Elastomer | Certification: | UL |
Thermal Conductivity: | 8.0W/m-K | Thickness: | 2.5mmT |
Keyword: | Thermal Interface Material | ||
Highlight: | 2.5mmT Thermal Silicone Pad,AI Thermal Interface Material,8W/mk Thermal Silicone Pad |
Factory 8W/mk Thermally Silicone Pad for AI
Ziitek TIF7100Q is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF7100Q is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Features
> Good thermal conductive: 8.0 W/mK
> Thickness: 2.5 mmT
> hardness:60±10
> Colour: gray
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Applications
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
Typical Properties of TIF71000Q Series
|
||||
Color
|
Blue |
Visual
|
Composite Thickness
|
Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion |
Ceramic filled silicone elastomer
|
***
|
10mils / 0.254 mm
|
0.16
|
20mils / 0.508 mm
|
0.20
|
|||
Specific gravity |
3.55 g/cc |
ASTM D297
|
30mils / 0.762 mm
|
0.31
|
40mils / 1.016 mm
|
0.36
|
|||
Thickness |
2.5mmT |
***
|
50mils / 1.270 mm
|
0.42
|
60mils / 1.524 mm
|
0.48
|
|||
Hardness
|
60±10 |
ASTM 2240
|
70mils / 1.778 mm
|
0.53
|
80mils / 2.032 mm
|
0.63
|
|||
Thermal conductivity |
8.0W/mk |
ASTMD5470
|
90mils / 2.286 mm
|
0.73
|
100mils / 2.540 mm
|
0.81
|
|||
Continuos Use Temp
|
-40 to 160℃
|
***
|
110mils / 2.794 mm
|
0.86
|
120mils / 3.048 mm
|
0.93
|
|||
Dielectric Breakdown Voltage
|
≥5500 VAC
|
ASTM D149
|
130mils / 3.302mm
|
1.00
|
140mils /3.556 mm
|
1.08
|
|||
Dielectric Constant
|
4.5MHz |
ASTM D150
|
150mils / 3.810 mm
|
1.13
|
160mils / 4.064 mm
|
1.20
|
|||
Volume Resistivity
|
≥ 5.2X1012
Ohm-cm |
ASTM D257
|
170mils / 4.318 mm
|
1.24
|
180mils / 4.572 mm
|
1.32
|
|||
Fire rating(no.E331100)
|
94-V0
|
equivalent
UL |
190mils / 4.826 mm
|
1.41
|
200mils / 5.080 mm
|
1.52
|
|||
Thermal conductivity
|
8.0 W/m-K |
GB-T32064
|
Visua l/ ASTM D751
|
ASTM D5470
|
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Contact Person: Dana Dai
Tel: 18153789196