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2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material

2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material

Large Image :  2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF7100Q thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Name: Factory 8W/mk Thermally Silicone Pad For AI Applications: CPU PC GPU
Material: Ceramic Filled Silicone Elastomer Certification: UL
Thermal Conductivity: 8.0W/m-K Thickness: 2.5mmT
Keyword: Thermal Interface Material
Highlight:

2.5mmT Thermal Silicone Pad

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AI Thermal Interface Material

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8W/mk Thermal Silicone Pad

Factory 8W/mk Thermally Silicone Pad for AI

 

 

Ziitek TIF7100Q is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF7100Q is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

 

TIF700Q-Series-Datasheet.pdf

 

 

2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material 0

 

Features

 

> Good thermal conductive: 8.0 W/mK

> Thickness: 2.5 mmT

> hardness:60±10

> Colour: gray

Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance

 

 

 

 

Applications

 

> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

 

 

 

Typical Properties of  TIF71000Q  Series
Color
Blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

 3.55 g/cc 

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness

2.5mmT

***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

60±10

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity

 8.0W/mk

ASTMD5470
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
≥5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

 4.5MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
≥ 5.2X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating(no.E331100)
94-V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

8.0 W/m-K

GB-T32064
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material 1

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)