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Product Details:
Payment & Shipping Terms:
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Name: | Thermal Interface Material Pads Thermal Silicone Pad For New Energy Vehicle Batteries PCB | Applications: | CPU PC GPU |
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Material: | Ceramic Filled Silicone Elastomer | Certification: | UL |
Thermal Conductivity: | 8.0W/m-K | Thickness: | 2.0mmT |
Keyword: | Thermal Interface Material | ||
Highlight: | Silicone Thermal interface material pads,PCB Thermal interface material pads,PCB Thermal Silicone Pad |
Thermal interface material pads Thermal silicone Pad for New Energy Vehicle Batteries PCB
Ziitek TIF780Q is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF780Q is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Features
> Good thermal conductive: 8.0 W/mK
> Thickness: 2.0 mmT
> hardness:60±10
> Colour: gray
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Applications
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
Typical Properties of TIF780Q Series
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Color
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Blue |
Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.55 g/cc |
ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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Thickness |
2.0mmT |
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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60±10 |
ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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Thermal conductivity |
8.0W/mk |
ASTMD5470
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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≥5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.5MHz |
ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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≥ 5.2X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating(no.E331100)
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94-V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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8.0 W/m-K |
GB-T32064
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Contact Person: Dana Dai
Tel: 18153789196