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Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes

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Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes

Large Image : Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	RoHs
Model Number:	TIE™ 280-25AB

Payment & Shipping Terms:

Minimum Order Quantity:	2kg/LOT
Packaging Details:	1kg/can
Delivery Time:	2-3 work day
Supply Ability:	1000KG

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Detailed Product Description

Keywords:	Thermal Conductive Glue	Hardness @25℃:	85 Shore D
Service Temperature:	-40℃ To +130℃	Glass Transition Temperature Tg:	92℃
Elongation:	0.10%	Thermal Conductivity:	2.5 W/m-K
Dielectric Strength:	300 Volts / Mil
Highlight:	Easy Application Epoxy Resin Adhesive , High Thermal Conductive Epoxy Resin Adhesive , Electronic Epoxy Resin Adhesive

Easy application epoxy potting compound glue electronic epoxy resin adhesive high thermal conductive potting epoxy adhes

TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.

Features

> Good thermal conductive: 2.5W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance

Application

> Automotive starters potting; General potting Thermal detector potting

> Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

> Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

> Power transformers and coils; Potting capacitors Potting of small electrical devices

> Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

> Optical / medical component adhesive

Typical Uncured Material TIE™ 280-25A (Resin)
Color	Black
Viscosity@25℃ Brookfield	3,000 cPs
Specific Gravity	2.1 g/cc
Shelf life @25℃ in sealed container	12 months
TIE™ 280-25B (Hardener)
Color	Black
Viscosity@25℃ Brookfield	5,000 cPs
Shelf life @25℃ in sealed container	12 months n

Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100
Viscosity @25℃	4,000 cPs
Working pot life (250 g @25℃)	45 min
Specific Gravity	2.1g/ccn
Cure Schedule
Cure 12 hours at 25℃
Cure 30 minutes at 70℃

Cured Properties
Hardness @25℃	85 Shore D
Service temperature	-40℃ to +130℃
Glass transition temperature Tg	92℃
Elongation	0.10%
Coefficient of thermal expansion, / ℃	3.0 X 10^-5
Fire resistance UL	Meet 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃	0.1

Thermal
Thermal Conductivity	2.5 W/m-K
Thermal Impedance @10psi	0.31 ℃-in²/W
ELECTRICAL AS CURED
Dielectric Strength	300 volts / mil
Dielectric Constant	4.2 MHz
Dissipation factor	0.029 MHz
Volume resistivity, ohm-cm @ 25℃	3.0 X 10¹²