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1.0-7.5W/mk Die Cut High Quality Thermal Pad Silicone Conductive Heatsink Cooler Pads

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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1.0-7.5W/mk Die Cut High Quality Thermal Pad Silicone Conductive Heatsink Cooler Pads

1.0-7.5W/mk Die Cut High Quality Thermal Pad Silicone Conductive Heatsink Cooler Pads

Large Image :  1.0-7.5W/mk Die Cut High Quality Thermal Pad Silicone Conductive Heatsink Cooler Pads

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF7180PUS thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Name: 1.0-7.5W/mk Die Cut High Quality Thermal Pad Silicone Conductive Heatsink Cooler Pads Applications: CPU PC GPU
Material: Ceramic Filled Silicone Elastomer Certification: UL
Thermal Conductivity: 7.5W/m-K Thickness: 4.5mmT
Keyword: Thermal Pad
Highlight:

7.5W/mk Die Cut Thermal Pad

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1.0-7.5W/mk Thermal Pad

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Silicone Conductive Heatsink Cooler Pads

1.0-7.5W/mk Die Cut High Quality Thermal Pad Silicone Conductive Heatsink Cooler Pads

 

 

Ziitek TIF7180HP is an extremely soft gap filling material rated at a thermal conductivity of 7.5 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF180HP is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

 

TIF700PUS-data sheet.pdf

 

 

1.0-7.5W/mk Die Cut High Quality Thermal Pad Silicone Conductive Heatsink Cooler Pads 0

 

Features

 

> Good thermal conductive: 7.5 W/mK

> Thickness: 4.5 mmT

> hardness:20

> Colour: gray

> Easy release construction
> Electrically isolating
> High durability

 

 

 

 

Applications

 

> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

 

 

 

 

Typical Properties of  TIF7180HP  Series
Color
Blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

 3.2 g/cc 

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness

4.5 mmT

***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

20

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity

 7.5W/mk

ASTMD5470
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
≥6000 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

 4.5MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
≥ 3.5X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

7.5 W/m-K

GB-T32064
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

1.0-7.5W/mk Die Cut High Quality Thermal Pad Silicone Conductive Heatsink Cooler Pads 1

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

 

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

 

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)