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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

Large Image : Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF7100PUS thermal pad

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 work days
Supply Ability:	100000pcs/day

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Detailed Product Description

Name:	Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad	Applications:	CPU PC GPU
Material:	Ceramic Filled Silicone Elastomer	Certification:	UL
Thermal Conductivity:	7.5W/m-K	Thickness:	2.5 MmT
Keyword:	Thermal Interface Pad
Highlight:	GPU heatsink cooling thermal interface pad , CPU heatsink cooling thermal interface pad , Conductive Silicon Thermal Interface Pad

Low thermal impedance conductive silicon gap filler GPU CPU heatsink cooling thermal interface pad

Ziitek TIF7100HP use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad 0

Features

> Good thermal conductive: 7.5 W/mK

> Thickness: 2.5 mmT

> hardness:20

> Colour: gray

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications.

Applications

> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF7100HP Series
Color	Blue	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.2 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	2.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	20	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Thermal conductivity	7.5W/mk	ASTMD5470	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	≥6000 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.5MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	≥ 3.5X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	7.5 W/m-K	GB-T32064	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad 1

FAQ

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Tag:

Contact Person: Dana Dai

Tel: 18153789196

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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

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