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Product Details:
Payment & Shipping Terms:
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| Certification: | UL | Keyword: | Grey Thermal Gap Filler |
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| Name: | China Thermal Pad Wholesaler Grey Thermal Gap Filler For Notebook | Applications: | Memory Modules |
| Thermal Conductivity: | 6.0 W/m-K | Material: | Silicone |
| Thickness: | 4.0mmT | ||
| High Light: | Electrically Isolating Thermal Gap Filler,Notebook Thermal Gap Filler,4.0mmT Grey Thermal Gap Filler |
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China Thermal Pad Wholesaler Grey Thermal Gap filler For Notebook
The TIF7160L-HM is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. TIF7160L-HM is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
TIF700L-HM-Series-Datasheet-REV02.pdf
Features
> Good thermal conductive: 6.0 W/mK
> Thickness: 4.0mmT
> hardness:30 shore 00
> Colour: Grey
> Easy release construction
> Electrically isolating
> High durability
Applications
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
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Typical Properties of TIF7160L-HM Series
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Color
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Grey |
Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.3 g/cc |
ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
4.0mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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30 Shore 00 |
ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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| Thermal conductivity |
6.0W/mk
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ASTMD5470
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.5MHz |
ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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6.0 W/m-K
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GB-T32064
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Contact Person: Miss. Dana
Tel: 18153789196
