Product Details:
Payment & Shipping Terms:
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Volume Resistiviyt: | 1.0X10^12 Ohm-cm | Construction & Compostion: | Ceramic Filled Silicone Elastomer |
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Name: | Moldability For Complex Parts Heat Sink Pad For Memory Modules, Continuos Use Temp -40 To 160℃ | Color: | Gray |
Specific Gravity: | 2.2 G/cc | Keyword: | Thermal Gap Pad |
Highlight: | 2.2 g/cc silicone thermal pad,memory modules silicone thermal pad,heatsink thermally conductive gap filler pads |
Moldability for complex parts Heat Sink Pad for Memory Modules, Continuos Use Temp -40 to 160℃
The TIF1140-10UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
TIF100-10UF Datasheet-REV02.pdf
Features
> Good thermal conductive: 1.5 W/mK
>Thickness: 3.5mmT
>hardness:75 shore 00
>Colour: gray
>Easy release construction
>Electrically isolating
>High durability
Applications
>mainboard/mother board
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
Typical Properties of TIF1140-10UF Series
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Color
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gray |
Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
2.2 g/cc |
ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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Thickness |
3.5mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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75 Shore 00 |
ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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Outgasing (TML) |
0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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3.9 MHz |
ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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1.5 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Contact Person: Dana Dai
Tel: 18153789196