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Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

Large Image : Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF1200-30-06UF

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 work days
Supply Ability:	100000pcs/day

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Detailed Product Description

Thickness:	5.0mmT	Name:	Specific Gravity 3.0 G/cc Heat Sink Pad Moldability For Complex Parts For Memory Modules
Fire Rating:	94 V0	Keyword:	Thermal Gap Pad
Feature:	Moldability For Complex Parts	Color:	White
Highlight:	3.0 g/cc thermal gap pad , memory modules thermal gap pad , 3.0 g/cc thermal interface pad

Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules

The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF1200-30-06UF is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Features

> Good thermal conductive: 3.0 W/mK

>Thickness: 5.0mmT

>hardness:75±5 shore 00

>Colour: White

>Moldability for complex parts
>Outstanding thermal performance
>High tack surface reduces contact resistance

Applications

>cooling components to the chassis of frame

>High speed mass storage drives

>Heat Sinking Housing at LED-lit BLU in LCD

>LED TV and LED-lit lamps

>RDRAM memory modules

>Micro heat pipe thermal solutions

Typical Properties of TIF1200-30-06UF Series
Color	White	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.0 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	5.0mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	75±5 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.32%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	5.0 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	2.3X10¹³ Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	3.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules 0

FAQ:

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

Tag:

Contact Person: Dana Dai

Tel: 18153789196

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Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

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