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1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction

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The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction

Large Image : 1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF170-30-06UF

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 work days
Supply Ability:	100000pcs/day

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Detailed Product Description

Keyword:	Thermal Gap Pad	Thickness:	1.75mmT
Fire Rating:	94 V0	Name:	1.75mmT Heat Snk Pad Easy Release Construction For Display Card
Feature:	Easy Release Construction	Continuos Use Temp:	-40 To 160℃
Highlight:	1.75mm thermal gap pad , easy release construction thermal gap pad , 1.75mm thermal interface pad

1.75mmT Heat Snk Pad Easy Release Construction for Display Card

The TIF170-30-06UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features

> Good thermal conductive: 3.0 W/mK

>Thickness: 1.75mmT

>hardness:75±5 shore 00

>Colour: White

>Good thermal conductive
Moldability for complex parts
Soft and compressible for low stress applications

Applications

>Automotive engine control units

>Telecommunication hardware

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>display card

Typical Properties of TIF170-30-06UF Series
Color	White	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.0 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	1.75mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	75±5 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.32%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	5.0 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	2.3X10¹³ Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	3.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction 0

FAQ:

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Tag:

Contact Person: Dana Dai

Tel: 18153789196

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1.75mmt Heat Snk Thermal Gap Pad Easy Release Construction

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