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Product Details:
Payment & Shipping Terms:
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| Application: | Heat Pipe Thermal Solutions | Outgassing(TML): | 0.32% |
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| Volume Resistivity: | 2.3X1013 Ohm-cm | Keyword: | Thermal Gap Pad |
| Specific Gravity: | 3.0 G/cc | Name: | Specific Gravity 3.0 G/cc Good Thermal Conductive Silicone Pads For Notebook |
| High Light: | 3.0 g/cc thermally conductive gap filler pads,3.0 g/cc silicone thermal pads,silicone thermal pads for notebook |
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Specific gravity 3.0 g/cc Good thermal conductive silicone pads for notebook
The TIF130-30-06UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF100-30-06UF-Series-Datasheet-.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness: 0.75mmT
>hardness:75±5 shore 00
>Colour: White
>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
Applications
>mainboard/mother board
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
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Typical Properties of TIF130-30-06UF Series
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Color
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White
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Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.0 g/cc
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ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
0.75mmT
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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75±5 Shore 00
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ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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| Outgasing (TML) |
0.32%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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5.0 MHz |
ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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2.3X1013
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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3.0 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ:
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
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4. We will reply you as soon as possible with Email or online
Contact Person: Miss. Dana
Tel: 18153789196
