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Product Details:
Payment & Shipping Terms:
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| Outgasing (TML): | 0.35% | Continuos Use Temp: | -40 To 160℃ |
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| Keyword: | Thermal Gap Pad | Thermal Conductive: | 3.0 W/mK |
| Name: | Moldability For Complex Parts -40 To 160℃ Silicone Pads For Heat Pipe Thermal Solutions | Thickness: | 2.0mmT |
| High Light: | 2mmt thermal gap pad,heat pipe solutions thermal gap pad,3.0 w mk gap pad material |
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Moldability for complex parts -40 to 160℃ silicone pads for Heat pipe thermal solutions
The TIF180-30-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-30-05US-Series-Datasheet.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:2.0mmT
>hardness:18 shore 00
>Colour: blue
>Electrically isolating
>High durability
>Good thermal conductive
Applications
>LED Power Supply
>LED Controller
>LED Ceilinglamp
>Monitoring the Power Box
>AD-DC Power Adapters
>Rainproof LED Power
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Typical Properties of TIF180-30-05US Series
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Color
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blue
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Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.0g/cc
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ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
2.0mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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18 Shore 00
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ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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| Outgasing (TML) |
0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.0 MHz
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ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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3.0 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Contact Person: Miss. Dana
Tel: 18153789196
