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4w Thermal Conductive Gap Pad 20 Shore00 3.1 G/Cc For Mainboard / Mother Board

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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4w Thermal Conductive Gap Pad 20 Shore00 3.1 G/Cc For Mainboard / Mother Board

4w Thermal Conductive Gap Pad 20 Shore00 3.1 G/Cc For Mainboard / Mother Board
4w Thermal Conductive Gap Pad 20 Shore00 3.1 G/Cc For Mainboard / Mother Board
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Large Image :  4w Thermal Conductive Gap Pad 20 Shore00 3.1 G/Cc For Mainboard / Mother Board

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF580-40-11US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Hardness: 20 Shore 00 Specific Gravity: 3.1 G/cc
Dielectric Breakdown Voltage: >5500 VAC Fire Rating: 94-V0
Construction & Compostion: Ceramic Filled Silicone Rubber Tensile Strength: 40 Psi
High Light:

4w thermal conductive gap pad

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thermal conductive gap pad 20 shore00

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Thermal Gap Pad 3.1 G/Cc

new developed 4w thermal conductive gap pad 20 shore00 silicone sheet 3.1 g/cc for mainboard/mother board
 
 
  The TIF580-40-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
 
TIF500-40-11US Datasheet-REV02.pdf
 
Features:
>  Good thermal conductive: 4.0 W/mK 
>Thickness:2.0mmT
>hardnesses :20 (Shore 00)

>Moldability for complex parts

>Soft and compressible for low stress applications

>RoHS compliant

>UL recognized

 
Applications:

>mainboard/mother board

>notebook

>power supply

>CD-Rom, DVD-Rom cooling

>LED Power Supply

>LED Controller

 
Typical Properties of TIF580-40-11US Series
Color

gray

Visual Composite Thickness  hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

3.1 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Thickness

2.0mmT

***

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
20 (Shore 00) ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
4.0 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
6.0X1013
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

 
Thermal conductivity 
4.0 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 
4w Thermal Conductive Gap Pad 20 Shore00 3.1 G/Cc For Mainboard / Mother Board 0
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

 

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)