Send Message
Home ProductsThermal Gap Filler

5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules
5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules 5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules 5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

Large Image :  5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF8100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Application: RDRAM Memory Modules Color: Gray
Thickness: 2.5mmT Feature: Thermal Conducting
Heat Conducctivity: 5W/mK
Highlight:

thermally conductive filler

,

thermal conductivity silicone

,

Thermal Gap Filler 2.5mmT

5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

 

  The TIF8100 use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


Features:

 

>  Perfect thermal conducting 
>  Good thermal conductive:  W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Thcikness: 2.5mmT

 


Applications:

 

> Cooling components to the chassis of frame

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment

> RDRAM memory modules

> LED TV and LED-lit lamps

> Automotive engine control units

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD

> Micro heat pipe thermal solutions

 

 

Typical Properties of TIF™8100
Color

gray

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.69 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
45 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
6.3X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V-0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

 
Standard Thicknesses:        
 
  0.100" (2.54mm)

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 
 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
 
5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules 0

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)