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High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 

High Quality 3.0W Thermal Conductive Pad  With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
High Quality 3.0W Thermal Conductive Pad  With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
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Large Image :  High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF™340
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Products Name: High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules Feature: Soft Ane Fiberglass Reinforced
Thermal Conductivity: 3.0W/m-K Keywords: Thermal Conductive Pad
Material: Ceramic Filled Silicone Elastomer Color: Gray
Hardness: 27±5 Shore 00
Highlight:

thermally conductive pad

,

thermal conductive material

,

2.8 W/mK thermally conductive gap filler pads

High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules

 

The TIF™340  is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

High Quality 3.0W Thermal Conductive Pad  With Fiberglass Reinforced Gap Filler Pad For Memory Modules  0

TIF300 Series Datasheet-(E)-REV02-CRM.pdf

 

Features:

 

> Outstanding thermal performance: 3.0W/mK 
> Moldability for complex parts
> Soft and Compressible for low stress applications
> RoHS compliant

>Easy release construction

>High durability


Applications

 

> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

Typical Properties of TIF™340 Series
Color Gray Visual
Construction &Compostion Ceramic filled silicone ******
Thinkness range 0.020"(0.50mm~0.200"(5.0mm) ASTM D374
Hardness 27±5 Shore 00 ASTM 2240
Specific Gravity 3.05 g/cc ASTM D792
Continuos Use Temp -40-160℃ ******
Dielectric BreakdownVoltage @ 1.0mm,AC(v) ≥5500 ASTM D149
Dielectric Constant @MHz 4.5 ASTM D150
Volume Resistivity(Ohm-cm) ≥1.0X10¹² Ohm-meter ASTM D257
Thermal conductivity 3.0 W/m-K ASTM D5470
Fire rating V-0 UL94

Product Thicknesses:

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

 

Product Sizes:

8"x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming


Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.

High Quality 3.0W Thermal Conductive Pad  With Fiberglass Reinforced Gap Filler Pad For Memory Modules  1

Packaging  Details & Lead time   

 

The packaging of thermal condauctive pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized   

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated  

 

Company profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Certifications:

 ISO9001:2015

 ISO14001: 2004 IATF16949:2016

 IECQ QC 080000:2017

 UL  

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

 

we will help you to deal with it and give you satisfactory solution.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)