Payment & Shipping Terms:
|Specific Gravity:||2.6g/cc||Thermal Diffusivity:||1.070mm2/s|
|Continuous Use Temp:||-45-200 ℃||Good Thermal Conductive:||2 W/mK|
thermally conductive putty,
electrically conductive putty
2W/mK yellow Soft Silicone Thermally Conductive Putty Gap Filler 2.6 g/cc 200V/mil For Radiating Modules
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
TIF020-19 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF020-19 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF020-19 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF020-19 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe ,Vihicel enginee controler
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
>Thermal conductivity: 2.0W/mK
>Soft, very low compression
|Construction & Composition||Ceramic filled silicon material||**********|
|Specific Gravity||2.6 g/cc||ASTM D297|
|Thermal conductivity||2.0 W/mK||ISO 22007-2|
|Thermal diffusivity||1.070 mm2/s||ISO 22007-2|
|Specific heat capacity||2.2 MJ/m3K||ISO 22007-2|
|Continuous Use Temperature||-45 ~200°C||******|
|Dielectric breakdown strength||200 V/mil||ASTM D149|
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Do it right the first time, total quality control
Work precisely and thoroughly for effectiveness
Quick response, On time delivery and Excellent service
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Contact Person: Dana