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Product Details:
Payment & Shipping Terms:
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| Specific Gravity: | 3.0 G/cc | Viscosity: | 2000,000cps |
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| Dielectric Breakdown Strength: | 200V/mil | Fire Rating: | 94-V0 |
| Color: | Blue | Continuous Use Temp: | -45-200 ℃ |
| Good Thermal Conductive: | 3.5 W/mK | Outgassing,%TML: | 0.80% |
| Highlight: | thermal putty,thermally conductive putty |
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New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK
TIF035-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF035-05 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF035-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-35 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
TIF035-05 Series Datasheet-REV02.pdf
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe ,Vihicel enginee controler
>Telecom industry
Feature
>Thermal conductivity: 3.5W/mK
>Soft, very low compression
>Operate automaticly
| TIF035-05 Property | |||
| Color | Blue | Visual | |
| Construction & Composition | Ceramic filled silicon material | ********** | |
| Viscosity | 2000,000cps | GB/T 10247 | |
| Specific Gravity | 3.0 g/cc | ASTM D297 | |
| Thermal conductivity | 3.5 W/mK | ISO 22007-2 | |
| Thermal diffusivity | 1.1073 mm2/s | ISO 22007-2 | |
| Specific heat capacity | 3.3 MJ/m3K | ISO 22007-2 | |
| Continuous Use Temperature | -45 ~200°C | ****** | |
| Dielectric breakdown strength | 200 V/mil | ASTM D149 | |
| Flame Rating | 94V0 | E331100 | |
| Outgassing,%TML | 0.80% | ASTM E595 |
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Package :
Product Specification:
•30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.
Company Profile
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Contact Person: Dana Dai
Tel: 18153789196
