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Fast Heat Dissipation Pad Garnet 1mmT Thermal Conductive Silicone Gap Pad TIF140-31E For IC Component

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Fast Heat Dissipation Pad Garnet 1mmT Thermal Conductive Silicone Gap Pad TIF140-31E For IC Component

Fast Heat Dissipation Pad Garnet 1mmT Thermal Conductive Silicone Gap Pad TIF140-31E For IC Component
Fast Heat Dissipation Pad Garnet 1mmT Thermal Conductive Silicone Gap Pad TIF140-31E For IC Component
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Large Image :  Fast Heat Dissipation Pad Garnet 1mmT Thermal Conductive Silicone Gap Pad TIF140-31E For IC Component

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140-31E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thickness: 1 MmT Thermal Conductivity: 1.5 W/m-K
Construction & Compostion: Ceramic Filled Silicone Rubber Specific Gravity: 2.75 G/cc
Color: Garnet Typical Properties: TIF140-31E
High Light:

heatsink thermal pad

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thermal conductive pad

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Thermal Gap Pad 2.75 g/cc

Fast heat dissipation pad garnet 1mmT thermal conductive silicone gap pad TIF140-31E for IC component

 

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

The TIF140-31E  thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 


Features:


>  Good thermal conductive: 1.5 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>Moldability for complex parts


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat pipe thermal solutions
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  mainboard/mother board
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 
Typical Properties of TIF140-31E Series
Color

Garnet

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm 0.36
20mils / 0.508 mm 0.41
Specific Gravity
2.75 g/cc ASTM D297

30mils / 0.762 mm

0.47

40mils / 1.016 mm

0.52
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.58

60mils / 1.524 mm

0.65

Hardness
35 Shore 00 ASTM 2240

70mils / 1.778 mm

0.72

80mils / 2.032 mm

0.79
Tensile Strength

45 psi

ASTM D412

90mils / 2.286 mm

0.87

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.01 

120mils / 3.048 mm

1.09 
Dielectric Breakdown Voltage
>10000 VAC ASTM D149

130mils / 3.302mm

1.17

140mils / 3.556 mm

1.24
Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

1.34

160mils / 4.064 mm

1.42
Volume Resistivity
7.8X10" Ohm-meter ASTM D257

170mils / 4.318 mm

1.50

180mils / 4.572 mm

1.60
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.68

200mils / 5.080 mm

1.77
Thermal conductivity
1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
 
Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
 
Fast Heat Dissipation Pad Garnet 1mmT Thermal Conductive Silicone Gap Pad TIF140-31E For IC Component 0
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Advantage

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 
 
 
 
 

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)