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High Quality High Performance Heat Desipition Insulated Thermal gap filler For Electronics Cooling

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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High Quality High Performance Heat Desipition Insulated Thermal gap filler For Electronics Cooling

High Quality High Performance Heat Desipition Insulated Thermal gap filler For Electronics Cooling
High Quality High Performance Heat Desipition Insulated Thermal gap filler For Electronics Cooling High Quality High Performance Heat Desipition Insulated Thermal gap filler For Electronics Cooling

Large Image :  High Quality High Performance Heat Desipition Insulated Thermal gap filler For Electronics Cooling

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF160-20-19F
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: High Quality High Performance Heat Desipition Insulated Thermal Silicone Pad For Electronics Cooling Thermal Conductivity& Compostion: 2.0 W/m-K
Specific Gravity: 2.7 G/cc Flame Rating: 94-V0
Color: Yellow Continuos Use Temp: -45 To 200℃
Hardness: 45 Shore 00 Keywords: Thermal Gap Filler
Application: Electronics Cooling
Highlight:

thermally conductive filler

,

thermal conductivity silicone

,

2.0W/mK silicone thermal gap filler

High Quality High Performance Heat Desipition Insulated Thermal Silicone Pad For Electronics Cooling

 

The TIF160-20-19F is an extremely soft gap filling material rated at a thermal conductivity of  2.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF160-20-19F is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.


Features:


>  Good thermal conductive:2.0 W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness

> RoHS compliant
> UL recognized
> Easy release construction

 

High Quality High Performance Heat Desipition Insulated Thermal gap filler For Electronics Cooling 0
Applications:


> Cooling components to the chassis of frame  
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Telecommunication hardware
> Handheld portable electronics
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF160-20-19F Series
Color Yellow Visual
Construction & Compostion Ceramic filled silicone elastomer *******
Specific Gravity 2.7g/cc ASTM D297
Thickness range 0.020"-0.200"(0.5mm~5.0mm) ASTM D374
Hardness 60 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Operating Temp -45 ~200℃ *******
Outgassing(TML) 0.40% ASTM E595
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity  1.0X1012Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 2.0W/mK ASTM D5470

 

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 
High Quality High Performance Heat Desipition Insulated Thermal gap filler For Electronics Cooling 1

 

Company profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

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