Breaking the Heat Dissipation Ceiling, Empowering the Future of AI: TIC800H Phase Change Thermal Material Ensures High-Performance Computing Power

Today, with the rapid development of artificial intelligence technology, high-power AI servers and chips are undertaking increasingly complex computing tasks. Heat dissipation has become a key bottleneck restricting the release of computing power. Traditional thermal pads and thermal grease have limitations in interface filling and long-term stability, urgently requiring more effective and reliable thermal management solutions. The TIC800H series phase change thermal materials have emerged as the times require, providing strong heat dissipation support for AI hardware with their innovative materials science and intelligent response characteristics.
 

I. Product Performance and Features

The TIC800H series is a high-performance phase change thermal material specifically designed for the heat dissipation of high-power AI servers and chips, combining the advantages of both thermal pads and paste applications. Its unique grain-oriented structure can conform to the surfaces of devices such as GPUs and AI acceleration chips, optimizing the thermal conduction path and efficiency. When the temperature exceeds the 50°C phase change point, the material intelligently softens and flows, fully filling the interface gaps of high-power chips, significantly reducing thermal resistance and helping to break through the heat dissipation bottleneck. It solves the problem of local overheating caused by poor interface contact.

Product features of TIC800H:
Excellent thermal conductivity: 7.5 W/mk
Low thermal resistance
Self-adhesive without the need for additional surface adhesives
Suitable for low-pressure application environments

2. Grain orientation technology, precise optimization of thermal path
With its unique grain-oriented structure, TIC800H can closely adhere to complex surfaces such as GPUs and AI acceleration chips, greatly optimizing the heat flow path. This technology significantly enhances thermal conductivity, ensuring that heat is rapidly and evenly dissipated from the heat source, thereby reducing the junction temperature of the chip and guaranteeing the stable operation of the hardware under high loads.
 

3. Intelligent Phase Change, Dynamic Adaptation to Operating Environment
When the chip temperature rises above 50℃, the TIC800H responds promptly, transforming from a solid state to a paste-like fluid, intelligently filling the space and significantly reducing the interface thermal resistance. This process is reversible; after the equipment is shut down and cooled, the material returns to its original form, avoiding dripping or drying out. It is particularly suitable for long-term high-temperature cycling conditions, extending the material's service life while ensuring consistent heat dissipation performance.
 

4. Born for AI computing hardware, facilitating stability and effectiveness
Whether it is the GPU in the device or the ASIC chip on the AI server, the TIC800H series can effectively address the challenge of high heat flux density, significantly reduce the chip temperature, and enhance system reliability. While reducing the risk of frequency reduction due to overheating and extending the hardware lifespan, it also provides a cooling foundation for the equipment to move towards higher computing power.