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Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃

Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00  -50 to 200℃
Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00  -50 to 200℃ Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00  -50 to 200℃ Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00  -50 to 200℃ Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00  -50 to 200℃

Large Image :  Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-07E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thermal Conductivity& Compostion: 3.0 W/m-K Specific Gravity: 2.85 G/cc
Color: Green Continuos Use Temp: -50 To 200℃
Hardness: 35 Shore 00
High Light:

thermally conductive filler

,

thermal conductivity silicone

Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00

 

 

  The TIF100-30-07E This product is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:


>  Good thermal conductive:3.0 W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF™100-30-07E Series
Color

Green

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.80 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
35 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 ps

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>10000 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
7.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
8X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
 
Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00  -50 to 200℃ 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: sales02

Tel: +8618153789196

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