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Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials

Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials
Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF860
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Application: LED Module Color: Gray
Thickness: 1.5mmT Hardness: 45 Shore 00
Heat Conducctivity: 5W/mK
High Light:

thermally conductive filler

,

thermal conductivity silicone

Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials

 

  The TIF860 is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


Features:

 

>  Perfect heat sinking 
>  Good thermal conductive:  W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Thcikness: 3mmT

 


Applications:

 

> LED TV and LED-lit lamps

> Automotive engine control units

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD

> Micro heat pipe thermal solutions

> Telecommunication hardware
>  Handheld portable electronics
> Semiconductor automated test equipment

> RDRAM memory modules

> Cooling components to the chassis of frame

 

 

Typical Properties of TIF™860
Color

gray

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.69 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
45 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
6.3X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V-0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

 
Standard Thicknesses:        
 
  0.060" (1.52mm)

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
 
Grey 1.5mm T Thermal Gap Filler , LED Module Heat Sinking Thermal Insulators Materials 0

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

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