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2020 new thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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2020 new thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

2020 new thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK
2020 new thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK 2020 new thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF035-05
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 600cc/tube
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Specific Gravity: 3.0 G/cc Viscosity: 2000,000cps
Dielectric Breakdown Strength: 200V/mil Fire Rating: 94-V0
Color: Blue Continuous Use Temp: -45-200 ℃
Good Thermal Conductive: 3.5 W/mK
High Light:

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thermally conductive putty

2020 new thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

 

TIF035-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF035-05 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF035-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-35 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

 

Application

 

>Heat-sink & frame

>LED backlight module,LED lighting

>High speed hardware driver

>Micro heat pipe ,Vihicel enginee controler

>Telecom industry

 

Feature

 

>Thermal conductivity: 3.5W/mK

>Soft, very low compression

>Operate automaticly

 

 

TIFTM035-05 Property
Color Blue Visual
Construction & Composition Ceramic filled silicon material **********
Viscosity 2000,000cps GB/T 10247
Specific Gravity 3.0 g/cc ASTM D297
Thermal conductivity 3.5 W/mK ISO 22007-2
Thermal diffusivity 1.1073 mm2/s ISO 22007-2
Specific heat capacity 3.3 MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C ******
Dielectric breakdown strength 200 V/mil ASTM D149
Flame Rating 94V0 E331100
Outgassing,%TML 0.80% ASTM E595
 

 

 

Package :

 

Product Specification:

•30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.

 

2020 new thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK 0

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

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