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Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks

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Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks

Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks
Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks

Large Image :  Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF030-05
Document: TIF030-05_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 7-15work days
Payment Terms: T/T
Supply Ability: 10000/day
Contact Now

Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks

Description
Product Name: Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks Density（g/cm³）: 3.25
Color: Blue Recommended Operating Temp(℃）: -40-200 ℃
Thermal Conductivity: 3.0W/m·K Keywords: Thermal Gel
Bond Line Thickness: 0.10mm Application: Micro Heat Pipe Heat Sinks
Highlight:

thermal putty

,

thermally conductive putty

Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks
TIF®030-05 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.
Features
  • Thermal conductivity: 3.0 W/mK
  • Soft, requires almost no pressure against components
  • Low thermal impedance
  • Easily adaptable for automated dispensing system operations
  • Proven long-term reliability
Applications
  • Heat-sink & frame
  • LED backlight module, LED lighting
  • High speed hardware driver
  • Micro heat pipe
  • Vehicle engine controller
  • Telecom industry
  • Semiconductor automatic laboratory equipment
Typical Properties of TIF®030-05 
Property Value Test Method
Color Blue Visual
Composition Ceramic filled silicon material -
Flow Rate (g/min) 30 ZKTM B014 (30 cc syringe/ 2.5mm orifice/90 psi)
Density (g/cm³) 3.25 ASTM D792
Thermal conductivity (W/m*K) 3.0 ASTM D5470
Thermal Impedance (℃.in²w) @10psi 0.080 ASTM D5470
Thermal Impedance (℃.in²w) @50psi 0.075 ASTM D5470
Recommended Operating Temp (℃) -40 ~200 ZKTM J025
Breakdown Strength (V/mm) ≥4000 ASTM D149
Bond Line Thickness (mm) 0.10 ZKTM B047
Oil Separation (%) @150°C,24 hrs ＜0.03 HG/T 2502
Volatility Loss (%) @150°C,24 hrs ＜0.2 HG/T 2502
Flame Rating V-0 UL 94
Product Specification
30 cc/pcs, 50cc/pcs, 300 cc/pcs, or custom packaging for automated applications.
For more information about thermal conductive materials, please contact our company.
Blue 3W Thermally Conductive Gel Thermal Gap Filler product image
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Frequently Asked Questions
How do I place an order?
1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us
4. We will reply you as soon as possible with Email or online
How do I request customized samples?
To request samples, you can leave us message on website, or just contact us by send email or call us.
What's the thermal conductivity test method given on the data sheet?
All the data in the sheet are actual tested. Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
What is Thermal Gel?
Thermal gel is a TIM (Thermal Interface Material) with good flowability and gap-filling capability. It can be applied through dispensing, coating, or other application methods to fill gaps between heat sources and cooling structures.
What is the main advantage of Thermal Gel?
The main advantage of thermal gel is its ability to adapt to complex structures and irregular gaps. It is particularly suitable for applications where multiple components with different heights need to be thermally managed simultaneously.
What size gap is Thermal Gel suitable for?
The applicable gap range varies depending on the specific thermal gel. It should be determined based on the product's flowability, curing characteristics, and assembly structure.
Will Thermal Gel flow or leak?
Different thermal gels have different rheological properties. During engineering design, factors such as high-temperature sag, flow behavior, and long-term stability should be evaluated to ensure reliable performance.

Tag:

thermally conductive putty,

thermal putty,

electrically conductive putty

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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