The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
ultra soft Thermal Conductive pad For LED lighting 4 W/M-K blue thermal silicone gap filler TIF100-40-12U The TIF100-40-12U thermally conductive interface materials are applied to fill the air gaps between the ... Read More
ultra soft Thermal Conductive Pad 2.0W/mk Light Green silicone gap filler 35 shore 00 The TIF150-20-18E The low modulus characteristic of the product offers optimal thermal performance with the ease of handling... Read More
Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler for Memory Modules The TIF100-14E Series thermally conductive interface materials are applied to fill the air gaps between the heating ... Read More
High conductivity 4w Thermal Conductive Pad 2mmT naturally tacky Silicone Thermal Pad -40 to 160 for IGBTs The TIF180-40-16E Series use a special process, with silicone as the base material, adding thermal ... Read More
China Manufacturer 2W Grey Thermal Conductive Pad TIF140-20-11E for Electrical Components The TIF140-20-11E thermally conductive interface materials are applied to fill the air gaps between the heating elements ... Read More
Fast heat dissipation pad garnet 1mmT thermal conductive silicone gap pad TIF140-31E for IC component Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal ... Read More
soft thermal pad 27shore00 3.5mmT thermal gap filler pad TIF3140 2.8W conductivity for cooling electronic elements The TIF3140 Series is recommended for applications that require a minimum amount of pressure on ... Read More
1.8W/mK, 20 shore00 thermal conductive pad 1.5mmT grey low cost for power supply The TIF560-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer ... Read More
Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant The TIF500S Series thermally conductive interface materials are applied to fill the air gaps between the heating ... Read More
High Dielectric Strength Thermal Conductive Pad For Telecommunication Hardware The TIF150-30-19S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the ... Read More