The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
High-Performance Semiconductor Electrical Insulating Sheet Thermal Conductive Silicone Gasket Sil Pad For IGBT Mosfet Products discription TIS800K series is a thermal silicone product featuring a ceramic-filled ... Read More
2.5W / mK Low Viscosity Thermal Conductive Glue with -40 - 130 Service Temperature TIE 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant ... Read More
Two Component Epoxy Thermal Conductive Glue for Potting LED Lighting Heat Spreader TIE 280-12AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant ... Read More
Two-Component RoHs compliant 2.5W/mK Thermal Conductive Glue for LED lighting Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturi... Read More
-40 - 200 LED Lighting Thermal Conductive Glue with Two Component Fire Resistant Silica Encapsulant TIS 680-28AB is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant ... Read More
Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow TIC800G series is low melting point thermal interface material. At 50, TIC800G series begins to soften and flow, ... Read More
Low Melting Materials Customized High Quality Phase Change Material For Notebook TIC812G series is low melting point thermal interface material. At 50, TIC800G series begins to soften and flow, filling the ... Read More
High Frequency Microprocessors Thermal Interface Pad Low Resistance -25 - 125 The TIC800P Series is low melting point thermal interface material. At 50, The TIC800P Series begins to soften and flow, filling the ... Read More
2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive The TIC803A Series is low melting point thermal interface material. At 50, The TIC800A Series begins to soften and flow, filling ... Read More
Gray -25 - 125 Thermal Interface Material Phase Change for High Power LED Lights TIC805G series is low melting point thermal interface material. At 50, TIC800G series begins to soften and flow, filling the ... Read More