The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
Gray High Voltage Isolation Heatsink Thermal Pads TIF100-20-11S Non Toxic 2.0W / mK For Micro Heat Pipe 45 Shore 00 The TIF100-20-11S Series thermally conductive interface materials are applied to fill the air ... Read More
China company supplied Heatsink Cooling 4W Thermal Gap Filler Ultra soft Low Thermal Resistance for Memory Modules The TIF100-40-12U thermally conductive interface materials are applied to fill the air gaps ... Read More
Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc The TIF140-30-49U is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat ... Read More
Pink 3.0W/mK Flexibility Thermal Conductive Pad TIF150-30-49U for Heat Housing at LED-lit 30 shore00, -40 to 160 The TIF150-30-49U thermally conductive interface materials are applied to fill the air gaps ... Read More
High performance thermally conductive acrylic adhesive tape For LED Mount Heat Sink Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... Read More
LED TV and LED-lit lamps Thermal Gap Filler Replace Bergquist Sil-PAD900 For CPU Heat Sinking Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution ... Read More
Thermal Gap Filler 2.0 W/m-K Temperature conductive silicone rubber pad For LED TV / LED-Lit Lamps 35 Shore 00 Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek ... Read More
Semiconductor automated test equipment (ATE) Thermal Gap Filler For CPU Heatsink Cooling The TIF100-15-07E use a special process, with silicone as the base material, adding thermal conductive powder and flame ... Read More
Semiconductor automated test equipment (ATE) Thermal Gap Filler For High Speed Mass Storage Drives The TIF100-12E thermally conductive interface materials are applied to fill the air gaps between the heating ... Read More
Compressible Thermal Gap Filler For Semiconductor Automated Test Equipment, High tack surface reduces resistance The TIF100-12F thermally conductive interface materials are applied to fill the air gaps between ... Read More