The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
High Performance Conductive Acrylic TIA800 Series 0.8W/MK Thermal Adhesive Tape With Double-Sided Adhesive The TIA800 Series is filled with good thermal conductivity ceramic particles, featuring excellent ... Read More
Glass Fiber Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA808FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
Ultra Thin LED Flat Light Thermal Adhesive Tape 0.8 W / mK with Double Sided Adhesive The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption ... Read More
Stable Operation Over A Wide Temperature Range White 0.8W/MK Thermal Conductivity Double-Sided Adhesive Tape For Power Device The TIA804 Series is filled with good thermal conductivity ceramic particles, ... Read More
The TIA810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low ... Read More
High Performance blue Acrylic Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
High Performance Aluminum Thermal Adhesive Tape For Power Converter PCB Heat Spreader The TIA800ALSeries products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption ... Read More
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Heat Sink Acrylic Based Gluehighly Double Side Thermal Conductive Acrylic Tape for LED strip The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More