The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
Ultra Thin LED Flat Light Thermal Adhesive Tape 0.8 W / mK with Double Sided Adhesive The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption ... Read More
Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength The TIA 800AL Series is widely used for bonding heat sinks to microprocessors and other ... Read More
Double Sided Thermal Adhesive Tape For Heatsink Product Overview The TIA 800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong ... Read More
Stable Operation Over A Wide Temperature Range White 0.8W/MK Thermal Conductivity Double-Sided Adhesive Tape For Power Device The TIA804 Series is filled with good thermal conductivity ceramic particles, ... Read More
Fiberglass Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA 808FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductor... Read More
The TIA810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low ... Read More
High Performance blue Acrylic Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Heat Sink Acrylic Based Glue - Highly Double Side Thermal Conductive Acrylic Tape For SMD LED Module The TIA 800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming ... Read More